Adhesion in China 2010 Issue 8 Application research of modified cyanate esters with CTBN in high temperature foamable adhesives

Home | Survey | Payment| Talks & Presentations | Job Opportunities

Journals A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Adhesion in China
1001-5922
2010 Issue 8

Application research of modified cyanate esters with CTBN in high temperature foamable adhesives
song jun jun ; wei yun zhao

..............page:60-62

Circular economy changes "enemy" into "in-laws"

..............page:33

Frequent security incidents challenge security of enterprise

..............page:36

TDI: Overcapacity alarm will be sounded in 2011

..............page:16-17

Good enterprises cherish life

..............page:34

xin xi dong tai

..............page:21,26-29,41,45,51,69,76-77

The production and consumption focus of global adhesives market was shifted to Asia

..............page:14-15

UV-light curing pressure-sensitive adhesive technology was held

..............page:30

Wind-power blades industrial development proposes higher requirements to chemical new materials

..............page:18-20

Synthesis of blocked polyisocyanate curing agent
dai su hong ; he wei ; zhao xiao lei

..............page:49-51

Development of thermoplastic polyimide toughened epoxy adhesive
mao jiang li ; xu mei fang ; yu zuo hai ; liu wan zhang

..............page:56-59

The chemical industry investment strategy in the next half year of 2010 is to closely pursue structural transformation of the economy and mine new material opportunities

..............page:22-23

Progress of application researches of epoxy resins
zhang yan

..............page:63-66

Tighten safety string in high temperature season

..............page:32

qing you xiu dang yuan zou shang qian tai

..............page:13

Development and applications of vinyl versatate
han wei hua ; zuo chao zuo

..............page:67-69

Read the "three kingdoms" and talk the different characters

..............page:37

Modification polymer and fibrous adhesiveness-reason for bonding strength and modifier dosage curve appear maximum value
chen yue hui

..............page:70-72

Effect of secondary structure on adhesion properties of soybean protein adhesives modified with alkalies
zuo ming wei ; liu jie ; zhang yan hua ; gu ji you

..............page:42-45

Heat stabilizers lead alternative process should be speeded up

..............page:24-25

Stay prepared against adversities in times of peace then business evergreen can begin

..............page:35

Preparation of pressure-sensitive adhesives for the production of sticky foam at ambient temperature
li zhi chao ; feng zhen gang

..............page:73-75

Preparation, structure and performance of silver-plating copper filled epoxy conductive adhesive
du liang liang ; zhou zhen tao ; lin xue hao ; yuan feng fu ; pan hui ming

..............page:38-41

Preparation and properties of epoxy resin/glass fiber/BN high thermal conductive composites
qi hai yuan ; qi shu hua ; li mei ling ; lu hui ling

..............page:52-55

Study on synthesis of polyurethane by frontal polymerization
gao chao ; huang zhi xiong

..............page:46-48

The 9th China (Shanghai) international photoelectricity exhibition of 2010 was held

..............page:31