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Adhesion in China
1001-5922
2008 Issue 3
xin xi
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page:4,11,15,25,31,36,45,49,56-57
jiao zhan ji xin zhuan li
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page:54-55
Bonding technology in 21st century——molecular adhesives
LI Jian-min
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page:50-53
Airport runway joint sealant materials and sealing design
LIN Yan-qin;LIU Jia;PAN Guang-ping
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page:46-49
Polarization modification of SBS thermoplastic elastomers and its application
DI Ming-wei;LIU Yang;ZHANG Yan-hua;GU Ji-you
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page:41-45
Recent progress for lead-free conductive adhesives
SUN Huan;YU Xin-hai;XU Yong-feng
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page:37-40
Research progress of modification of acrylic resin adhesives
WANG Qi;FU He-qing;HUANG Hong;CHEN Huan-qin
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page:32-36
Latent curing agents for one-component epoxy resin adhesives
WANG Hong-zhuo;WANG Ying
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page:28-31
Studies of production process of starch adhesive obtained by H2O2-oxidizing in room temperature
DING Xiao-min
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page:26-27
Study on performance of organosilicone-modified acrylates latexes
ZHANG Li;CHEN Tong;YIN Song
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page:23-25
Study of compounding of waterborne polyurethane pressure-sensitive adhesives using uniform design and orthogonal design
LI Bing;TANG Deng;JI Xue-shun;BAO Jun-jie;XU Ge-wen
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page:19-22
Study on synthesis of grafted polyether polyols
YU Liang-min;WANG Zhing-wei;LI Fang
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page:16-18
Study on performance of wood-flour filled sealants for cavity-glass
WANG Jing;LIU Guo-jun;ZHANG Gui-xia;LIU Jun-long;HU Bin;LI Hui-lian
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page:12-15
Study on preparation process and corrosion resistance of epoxy/OMMT adhesive
WANG Li-hua;TANG Ming;LI Xiao;GU Ya-xin
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page:8-11
Preparation of core-shell structure water-emulsion adhesive for paper-plastic laminating
ZHAO Li-ying;LIU Chang-sheng
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page:5-7
On curing reaction characteristics of low-toxicity urea-formaldehyde resins containing blocked isocyanate
ZHU Li-bin;GU Ji-you;ZHANG Yan-hua
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page:1-4