1001-5922
2008 Issue 11
Application of adhesives in incense industry
LUO Tong-tong;LU Ya-ping;LI Qiang
LUO Tong-tong;LU Ya-ping;LI Qiang
..............page:52-53
Development survey of high-temperature resistant organic adhesives
QI Gui-liang;WANG Xi-mei;ZHANG Yu-long
QI Gui-liang;WANG Xi-mei;ZHANG Yu-long
..............page:47-51
..............page:41-46
Current application situation of conductive adhesives
CHEN Hong-jiang;YU Xin-hai;LIU Wan-zhang
CHEN Hong-jiang;YU Xin-hai;LIU Wan-zhang
..............page:37-40
On synthesis ways of biuret-containing polyisocyanates
PENG Dan;ZHANG Xiao-huan;LU Guo-lin
PENG Dan;ZHANG Xiao-huan;LU Guo-lin
..............page:33-36
Preparation and application of adhesive used in bonding and sealing for aircraft antenna
YANG Min;TANG Li-dao;WANG Bao-xia
YANG Min;TANG Li-dao;WANG Bao-xia
..............page:30-32
Development of a new curing agent for epoxy resin
DENG Xiao-qin
DENG Xiao-qin
..............page:26-29
..............page:23-25
Epoxy resin adhesive with high thixotropy
SHI Ming-hui
SHI Ming-hui
..............page:19-22
Development of modified PVB based wood adhesive
WU Fei;TAN Zheng-de;SHANG Jun-jun
WU Fei;TAN Zheng-de;SHANG Jun-jun
..............page:15-18
Structure and properties of polyurethane/polyhedral oligomeric silsesquioxane (POSS) crosslinked materials
TAO Yu-lun;WEI Ya-feng;ZHANG Xian-li
TAO Yu-lun;WEI Ya-feng;ZHANG Xian-li
..............page:10-14
Preparation of a novel curing for epoxy resin agent and study on its curing reaction kinetics
SUN Huan;YU Xin-hai;LIU Wan-zhang;XU Yong-fen;FU Ju-sun
SUN Huan;YU Xin-hai;LIU Wan-zhang;XU Yong-fen;FU Ju-sun
..............page:5-9
Preparation of fluoroacrylate-polyurethane copolymer by miniemulsion polymerization
GUO Xiao-li;XIONG Sheng-dong;YI Chang-feng;XU Zu-shun
GUO Xiao-li;XIONG Sheng-dong;YI Chang-feng;XU Zu-shun
..............page:1-4