Home
|
Survey
|
Payment
|
Talks & Presentations
|
Job Opportunities
Journals
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
W
X
Y
Z
Adhesion in China
1001-5922
2008 Issue 10
xin xi
..............
page:4,8,20,24,31,37,41
jiao zhan ji xin zhuan li
..............
page:50-52
Reasons and countermeasures for untight seal of cold sealing film
GUO Xin-hua
..............
page:47-49
Analysis on stress distributions in new type single-lap-joint of dissimilar adherends
SUN De-xin
..............
page:45-46,49
Current status of research and applications of anisotropic conductive adhesives
XIANG Hao;ZENG Li-ming;HU Chuan-qun
..............
page:42-44
Research progress on modification of aqueous polyurethane adhesives
LIU Jie;ZHANG Ran;YANG Jian-jun;ZHANG Jia-nan;WU Qing-yun;WU Ming-yuan
..............
page:38-41
Synthesis and applications of polyimide
LIAO Xue-ming;SONG Zhi-xiang;SHE Wan-neng;QU Xiu-ning;LIU Liang-yan
..............
page:32-37
Development of water emulsion adhesive for paper/plastic laminating
FU Xin-jian;ZHANG Hua;LIU Shao-bing;ZHOU Si-kai
..............
page:28-31
Preparation and properties of boron modified phenolic resin
CHENG Wen-xi;MIAO Wei;XI Xiuj-uan;JIANG Jin-zhou
..............
page:25-27
Epoxy potting materials for automobile ignition coils
SHI Na;DENG Ji-chun;DAI Hong-cheng
..............
page:21-24
On process conditions of preparing CTBN toughened epoxy resin adhesives
JIANG Min;YAO Yuan
..............
page:17-20
Preparation of polyacrylate vinylidene chloride/antimony trioxide composite emulsion
ZHENG Gen-wen;WEN Sheng;WANG Cai-xia
..............
page:14-16
Preparation and characterization of DDM/EP/CTBN toughened BMI-based heat-resistant adhesives
HU Fei;ZHANG Liang-jun;FAN Qing-chun;TONG Shen-yi
..............
page:9-13
Synthesis and properties of doubly modified phenolic resin
XU Li;SITU Yue;HU Jian-feng;ZENG Han-wei;CHEN Huan-qin
..............
page:5-8
Investigation on properties of PVAc/SiO2 nanocomposites
XU Hong-bin;HU Hong-jiu;LI Da-kai;LI Jie;TANG Ao-jie
..............
page:1-4