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Adhesion in China
1001-5922
2000 Issue 2
zhuan li
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page:46
Control quality of adhesion technology to bus skirt doors
Fang Guigang;Huang Shumin
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page:43-44
Reinforce of base beam of the tipper with bonding techndogy
Zhou Yaping
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page:42-43
Preparation of hust-snack box with bonding technology
Chen Lixin;Jiao Jian;Di Xiyan
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page:41-42
Bonding example of break equipment
Zhao Xiying;He Yingbin
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page:40-41
Developments on advanced epoxy resins
Jiao Jian;Lan Liwen;Di Xiyan
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page:33-39
The mechanical analyses to bind-round coating adhesive joint on water piper
Long Guangzhi;Wang Lihua
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page:30-32
Effects of isocyanate base coating on the adhesion properties of pressure-sensitive tape
Zhu Yuequn;Ning Rongchang
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page:27-29
Characterization of properties of PHMS/BA composite emulsion film
Huang Guangfo;Peng HuiLi;Shengbiao;Huang Shiqiang
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page:24-26
The synthesis and characterization of a new latent curing agentof epoxy resin
Zhong Wenbin;Huang Qigu;Zou Ailan;Wang Xiayu
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page:22-23
Preparation of modified co polyamide hot melt adhesives
Jiang haibing;Huang Feng;Wei Borong
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page:20-21,26
The improvement of adhesion properties of α-cyanoacrylate
Wang Bo;Di Mingwei;Guo Jinyan;Sun Mingming;Jiang Xingsheng;Zhang Junying
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page:17-19
Study on the interfacial behavior between PVAc/VAE blends emulsion and polyolefin
He Xiuzhen;Song Zhiying;Zhang Shengwen
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page:13-16
Study on the bonding properties of no-bake epoxy resin sand for foundry
Liu Xiangdong;Xiao Keze;Wang Wenqing;Dai Xuqi
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page:10-12
Study on the heat-resistant adhesive ANDPO-epoxy resin
Liu Jiyan;Liu Xueqing;He li;Li Zhongming
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page:7-9
Investigation of catalysts in one-component moisture-curable polyurethane sealant
Li Yongde;Tan Shangfei
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page:4-6
Study on high solid multi-sized polymer latex 2.Preparation of bi-modal particle size distribution latices by using two seeds
Chu Fuxiang;Tang Chuanbing;Alain Guyot
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page:1-3,9