Home | Survey | Payment| Talks & Presentations | Job Opportunities
Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronic Components & Materials
1001-2028
2016 Issue 2
Fabrication of TiO2/Ag/PAA nanocomposite structures and their optical absorption properties
CHENG Weijie;CHEN Qun;YANG Chunyan;YIN Min;ZHU Xufei;School of Chemical Engineering;Nanjing University of Science and Technology;Shanghai Advanced Research Institute;Chinese Academy of Sciences;
..............page:1-4
Microwave-assisted liquid phase synthesis and formaldehyde gas-sensing properties of LaFeO3 nanocrystal
WANG Huanxin;ZHENG Xianjun;GUI Yanghai;College of Material and Chemical Engineering;Zhengzhou Institute of Light Industry;
..............page:5-8
Effect on microstructure of single layer graphene in low temperature oxygen plasma treatment
DENG Haijun;WANG Quan;School of Mechanical Engineering;Jiangsu University;State Key Lab of Transducer Technology;Chinese Academy of Sciences;
..............page:9-13
Effect of Cu doping on structure and magnetic properties of CoFe2O4
WANG Wei;XIANG Pingping;JU Hailang;CHENG Peng;LI Baohe;School of Science;Beijing Technology and Business University;
..............page:14-17
Magnetic properties of Fe3Si nanoparticles synthesized by low temperature solid-phase reaction method
CAI Xinqi;WANG Lin;HE Jian;LI Lin;LI Yuebin;Hubei Key Laboratory of Ferro & Piezoelectric Materials and Devices;Faculty of Physics and Electronic Science;Hubei University;Chucai College;Hubei University;
..............page:18-21
Influence of Nd2O3 doping on the properties and structure of BCZT lead-free piezoelectric ceramics
YIN Jia;HUANG Xinyou;YUE Zhenxing;GAO Chunhua;School of Materials Science and Engineering;Jiangsu University;State Key Laboratory of New Ceramics and Fine Processing;Tsinghua University;
..............page:22-25
Research on electrochemical performance of lithium bis(oxalate)borate for supercapacitor
LIU Hui;ZHENG Wenzhi;CHEN Yao;YU Xinwei;ZHANG Qing;School of Chemistry and Chemical Engineering;Guangzhou University;
..............page:26-30
Study on preparation technology of P-type silicon epitaxial wafer with three layers of composite structure
LI Mingda;CHEN Tao;LI Pusheng;XUE Bing;The 46th Research Institute of China Electronics Technology Group Corporation;
..............page:31-34
A fully on chip LDO with ultra low noise and fast set up
CHEN Yuanlong;ZHANG Tao;WANG Ying;ZHANG Guojun;State Key Laboratory of Electronic Thin Films and Integration Device;University of Electronic Science and Technology of China;
..............page:35-38
Ultra-wide stopband low-pass filter based on defect ground structure
WANG Bin;GUO Jia;HUANG Wen;JING Lin;College of Electronic Engineering;Chongqing University of Posts and Telecommunications;
..............page:39-42
Design of bandpass filter based on spoof surface plasmon polaritons
XIAO Binggang;CHEN Jing;KONG Sheng;College Information Engineering;China Jiliang University;
..............page:43-46
Design of a bending dipole RFID antenna at UHF band
DONG Jian;YU Xiaping;REN Huabin;LI Donglin;School of Information Science and Engineering;Central South University;Dongguan Huabei Electronic Technology Co.;Ltd;
..............page:47-51
Research of water-based conductive ink and its conductive property
SUN Jinmei;TAO Yeli;ZHANG Lin;Material & Industrial Technology Research Institute;
..............page:52-55
Lead-free electronic glass powders of lower temperature sintering and acid-resisting
ZHANG Zhixu;LI Hongjie;QU Haixia;JI Liangjun;WU Qiaoli;Xi;an Chuanglian Hongsheng Electronic Co.;Ltd;
..............page:56-59
Optimization on storage stability of Sn0.3Ag0.7Cu solder paste
HAN Shuai;ZHAO Maiqun;SONG Na;School of Materials Science and Engineering;Xi’an University of Technology;
..............page:60-64
Effect of RE microalloying in substrate on interface reaction of Sn3Ag0.5Cu/Cu solder joint
XU Tao;HU Xiaowu;JIANG Xiongxin;School of Mechanical Electrical Engineering;Nanchang University;
..............page:65-69
Experimental study on the effect of reflow soldering temperature curve on the shape of solder joint
YANG Xuexia;ZHANG Yu;SHU Xuefeng;School of Applied Science;Taiyuan University of Science and Technology;School of Mechanical Engineering and Automation;Northeastern University;Institute of Applied Mechanics;Taiyuan University of Science and Technology;
..............page:70-72+78
Reliability study of high-breakdown voltage high-power switch transistors under DC condition
ZHOU Tao;LU Xiaodong;WU Yuanqing;XIA Tingting;School of New Energy;Bohai University;
..............page:73-78
Remaining useful life prognostic of power MOSFET based on data-driven
WU Lifeng;YIN Cuixiang;ZHENG Yu;GUAN Yong;College of Information Engineering;Capital Normal University;Beijing Engineering Research Centre of High Reliable Embedded System;Capital Normal University;Beijing Key Laboratory of Electronic System Reliability Technology;Capital Normal University;
..............page:79-83
ben kan xin xi
..............page:83