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Electronic Components & Materials
1001-2028
2015 Issue 4
Application and research progress of liquid crystal materials in THz band
CHEN Zezhang;ZHAO Hongzhi;LI Meng;BU Jing;MA Heng;College of Physics and Electronic Engineering;Xinxiang University;College of Physics and Electronic Engineering;Henan Normal University;
..............page:1-4
Molten salt synthesis and microstructures analysis of Bi3.15Nd0.85Ti3O12 microplates
QI Hongyan;LIU Yong;XIAO Ming;LI Dan;QIN Xinyan;Institute of Information Science and Technology;Department of Physics and Mechanical & Electrical Engineering;Hubei University of Education;
..............page:5-9
ben kan xin xi
..............page:9
Research on the process of nano tin oxide powders prepared by high energy ball milling
LIU Songtao;SI Fang;WANG Junbo;CAO Feng;YANG Minge;Mechanical and Electronic Engineering College;Xi’an Polytechnic University;
..............page:10-13+31
Front surface field on N type back contact crystalline silicon solar cell
ZHOU Tao;ZHAO Yang;LU Xiaodong;ZHANG Peng;LI Yuan;School of New Energy;Bohai University;
..............page:14-18
Near infrared luminescence in Er3+/Tm3+ co-doped tellurite glasses
WANG Chun;HU Yichen;ZHANG Ming;LI Lei;SARDAR;College of Materials Science and Engineering;East China University of Science and Technology;
..............page:19-21
Influence of packaging material optical properties on white LED luminous flux
ZHU Sanmei;ZHANG Wen;Wuhan Railway Vocational College of Technology;Wuhan Huitian Tongkang Electronic Technology Corporation;
..............page:22-25+31
Dual-frequency excitation for variable gap capacitive displacement transducer
ZHANG Lifeng;YU Hongxiang;SHEN Mengfeng;Institute of Motion Detection & Intelligent Control Research;Zhejiang Normal University;
..............page:26-31
Dual-band transversal bandpass filters using dual-mode resonator
XIANG Tianyu;LEI Tao;HU Shengbo;School of Mechanical and Electrical Engineering;Guizhou Normal University;College of Electronics and Information Engineering;Guizhou University;
..............page:32-34+46
Design of micro-strip low-pass filter based on Hilbert fractal shape defected ground structure
LI Ziyi;YANG Weiming;HU Chengkang;ZHU Xingyu;PENG Juhong;School of Computer & Information Engineering;Hubei University;
..............page:35-38+46
Novel wideband bandpass filter-based on anti-coupled line
HUANG Kai;ZHANG Shen;BEI Lulu;School of Information and Electrical Engineering;China University of Mining and Technology;Internet of Things Perception Mine Research Center;China University of Mining and Technology;
..............page:39-42
Analysis of wire antenna nearby metal carrier based on MOM
XIE Guangqian;LIU Bo;ZHANG Xiaoyang;LIU Juanni;XIAO Huachao;Xi’an Academy of China Academy of Space Technology;
..............page:43-46
Design of omnidirectional conformal microstrip antenna array
HAO Honggang;WANG Shaowen;RUAN Wei;HE Yong;School of Optical and Electronic Engineering;Chongqing University of Posts and Telecommunications;
..............page:47-50
Dual-frequency microstrip antenna for WLAN/WiMAX applications
SHAO Junhuan;WANG Xinyan;GAO Yuheng;WEI Wendeng;LYU Yuxiang;College of Physics and Optoelectronics;Taiyuan University of Technology;Shanxi Lyuliang Electric Power Supply Company;Transmitting Electricity Detect Department of Shanxi Lyuliang Electric Power Supply Company;
..............page:51-54
Design of a microwave frequency generator based on frequency multiplication
YANG Ning;QIU Qi;SU Jun;School of Optoelectronic information;University of Electronic Science and Technology of China;
..............page:55-58
Electromigration failure simulation and optimization analysis for Sn0.7Cu lead-free solder
ZHAO Yuanhu;ZHANG Yuanxiang;XU Yangjian;LIANG Lihua;College of Mechanical Engineering;Zhejiang University of Technology;College of Mechanical Engineering;Quzhou University;
..............page:59-63
Sintering property of Ni-plating package applied in microwave module
CHEN Jie;MA Lili;Microwave Circuit & System Institute;Chengdu Yaguang Electronics Co.;Ltd;
..............page:64-68
Mechanical properties of SnSb4.5CuNi/Cu joints during isothermal aging
CHEN Haiyan;XIE Yu;YU Guida;ZENG Jianbo;School of Materials and Energy;Guangdong University of Technology;Guangzhou Dtech Electronics Technology Co.;Ltd;
..............page:69-73
Study on coupling analysis of electromagnetic-thermal-structure for TSV
HUANG Qiongqiong;SHANG Yuling;ZHANG Ming;LI Chunquan;KUANG Xiaole;Guilin Chinghai Development Co.;Ltd;Guilin University of Electronic Technology;Nanjing Marine Radar Institute;
..............page:74-78
Reliability study of system in package consisting of CPU and DDR chips
TANG Yu;LIAO Xiaoyu;LUO Shaoming;WANG Keqiang;LI Guoyuan;College of Automation;Zhongkai University of Agriculture and Engineering;School of Electronic and Information Engineering;South China University of Technology;
..............page:79-83
te shu jia gu smd jing zhen de kang gao guo zai xing neng yan jiu
wang yan ; shen rui zuo ; zuo xiao wei ; liu wei ;
..............page:84-86
hao mi bo gong lv fang da qi de yu shi zhen xian xing hua gai jin yan jiu
ge wei jun ; zhu long biao ;
..............page:87-89
ben kan shu xun
..............page:91
ben kan 2015 nian can hui xin xi
..............page:94