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Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronic Components & Materials
1001-2028
2014 Issue 2
Development of flip chip package technology
huang jin zuo ;, liu pei sheng ;, lu ying ;, wang jin lan ;, yang long long ;
..............page:1-5,15
Develop of manufacture techniques of IC package substrate ultra-fine lines
liu qiu hua ;, wu mei zhu ;, wu xiao long ;, xu jie dong ;, zhou wen mu ;
..............page:6-9,15
Recent advances of optical and electrical simulations in plasmonic silicon-based thin-film solar cell
chen xiao yuan ;, guo rui chao ;, huang hong tao ;, li dong dong ;, zhu ben peng ;
..............page:10-15
Study of the influence factors on the electrical and thermal conductivity of conductive adhesive
wan chao ;, wang ling ;, wang peng cheng ;, yi ying ;, zhu zuo ;
..............page:16-19
Growth of lanthanum manganate buffer layers for coated conductors via a metal-organic decomposition process
guo pei ;, tao bo wan ;, xiong jie ;, xu wen li ;, zhao xiao hui ;
..............page:20-23
Design of a miniaturized sum and difference power divider
jing shou zuo ;, tang cong ;, wu zuo ;
..............page:24-26
Dimensional numerical simulation of heat transfer and structural optimization of electronic equipment radiator
he yun ban ;, wang jun xia ;, zuo shi lin ;
..............page:27-29,34
Design of a bandgap reference with low temperature-drift and low power consumption
feng quan yuan ;, tang yu ;
..............page:35-38
Effect of electroless copper plating on copper film of thick film ceramic substrate coated copper
fang jun ;, fu ren li ;, jiang wei na ;, qian zuo ;, zhang peng fei ;
..............page:39-42
Effects of heat treatment temperature on the properties of the film inductor with CoTaZr magnetic core
chen xian chao ;, he yu ding ;, li hui ;, xie zhi zuo ;, yang yuan zheng ;
..............page:43-46,51
Influence of ceramic substrate and soldering join technology on thermal dissipation performance of LED
fang jun ;, fu ren li ;, qian zuo ;, zhang peng fei ;, zhang yu ;
..............page:47-51
Peak current mode LED driver IC with threshold compensation
ma yun lin ;
..............page:52-55
Effects of La2O3 and Sm2O3 doping on structure and properties of SrTiO3 ceramics
luo jian ;, zhang xu ;, zhong chao wei ;
..............page:56-60
Effects of CCTO doping on low-frequency thermally stable BaTiO3-based ceramics
wu zuo yang ;, xiao zuo ;
..............page:61-64
Effect of Ca/Si mol ratio on microstructure and properties of CaO-B2O3-SiO2 glass ceramics
feng zhi qiang ;, hao ling yun ;, wei peng fei ;, yang xiao li ;, ye yuan feng ;
..............page:65-67
Recognition for counterfeit Ta-capacitor
wei ai xin ;
..............page:71-75
liang zi dian tai yang neng dian chi yan fa dong tai
jiang wei ;
..............page:80-81
matlab ruan jian zai tai yang neng dian chi yan jiu zhong de ying yong
he su xia ;, le li qin ;
..............page:82-83
wu xian chuan gan qi wang luo zhong de gong dian xin ji shu
du guang chao ;
..............page:86-87
chuan gan qi zai fa dian chang zhong de ying yong
zhang hai yan ;, zhang li xiang ;
..............page:92-93
re shi dian hong wai chuan gan qi de ji shu dong tai
jiang bing ;, lei xian guo ;, zheng shi chun ;
..............page:94-95
xin xi dong tai
..............page:96