Electronic Components & Materials 2014 Issue 11 Overview on LTCC microfluidic device fabrication

Overview on LTCC microfluidic device fabrication
GAO Nengwu;,QIN Yueli;

..............page:1-4

shi mo xi huo jiang yong lai zhi zao tai yang neng dian chi

..............page:4-4

Overview on LTCC technology and its development
HU Yongda;,YANG Bangchao;

..............page:5-9,13

Analysis of patent evolution of Cu pillar bump technology
LIN Zhongming;,LIU Peisheng;,TAO Yujuan;

..............page:10-13

Research progress on the conducting inks of metal silver
GU Shanqun;,LI Jinhuan;,LU Jianhui;,WANG Tangyang;,WANG Yufeng;,XIAO Jun;

..............page:14-17

Device structure analysis of CIGS thin film solar cell
XIAO Youpeng;,XIONG Zhihua;,ZHOU Mingbin;

..............page:18-23

New-structured solar cells based on organic-inorganic perovskite materials
CHEN Haijun;,HE Hongcai;,WANG Ning;

..............page:24-28

Research progress of SnO2 hierarchical nanostructures
DU Guofang;,QIN Guohui;,WANG Hai;,ZHAO Heyun;,ZHAO Kang;

..............page:29-35

Synthesis and conversion luminescence of CdWO4 nanorods
HOU Bing;,KOU Junjiao;,LIU Lianli;,WANG Hui;,XU Shuying;

..............page:36-38,43

Preparation and performance of BaO-ZnO-B2O3-SiO2 glass by sol-gel method
FANG Jun;,FU Renli;,LI Chenyang;,YU Shouyu;,ZHANG Jie;

..............page:39-43

2014 nuo bei er wu li xue jiang lan guang led zhao liang shi jie

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Fabrication and mechanical properties investigation of encapsulation epoxy resin
CHEN Ying;,FAN Jinghui;,HUANG Haiying;,ZHANG Kai;,ZHENG Xing;

..............page:44-46

Parameters optimization of high stability bath for electroless copper plating
CHEN Jinju;,FENG Zhesheng;,WANG Dayong;,XUE Wenming;,YANG Chao;

..............page:47-51,55

Fabrication and magnetic properties of CNTs/polyaniline/Fe3O4 composites
CHENG Junye;,WU Chao;,ZHAO Bin;

..............page:52-55

Preparation process optimization of iron powder ring cores
LIU Zhongwu;,WAN Juan;,WANG Jin;,WANG Min;,ZHENG Zhigang;

..............page:56-60

Novel LED module design and technology innovation
SUN Yunlong;

..............page:61-62,69

Plasma desmear process of rigid-flex printed circuit board and its optimization
HE Peng;,HE Wei;,JIANG Junfeng;,XU Huan;,ZHOU Guoyun;

..............page:63-66,69

Design and simulation on a new coplanar ultra-wideband monopole-like slot antenna
HUANG Lu;,WANG Ning;

..............page:67-69

Research of geomagnetic field detection based on the magnetoresistance effect
GUO Xin;,TANG Xiaoli;,ZHANG Huaiwu;,ZHAO Zhenxiang;

..............page:70-72

Design and implementation of an X-band high performance low noise amplifier
GE Junxiang;,MA Zhiqiang;,XU Zhun;,ZHOU Bei;

..............page:73-76,80

On-line gas needling joining method for C/SiC composites
CHENG Laifei;,TONG Qiaoying;

..............page:77-80

Influences of structure parameters of PCBA and random vibration spectra on the fatigue life of BGA solder joint
HE Min;

..............page:81-85

Vibration fatigue behavior of micro-interconnection low-Ag lead-free solder joints
DOU Xin;,GENG Yanfei;,LIU Huawen;,WEI Song;,YIN Limeng;

..............page:86-89

Research of interfacial reaction and growth behavior of intermetallic compounds in Sn0.7Cu-xEr/Cu solder joints
HU Xiaowu;,LI Yulong;,MIN Zhixian;,YU Xiao;

..............page:90-94,98

Property study of Sn-Zn-Bi-In-P lead-free solder
LI Shengming;,MA Jusheng;,WANG Zhenghong;,YU Hongjiao;,ZHANG Gong;

..............page:95-98

Dispensing process research of solder paste
LIU Shangchao;,WANG Xiaoli;,XU Yanjun;

..............page:99-103

Distribution of initial contact resistance of contact and its relationship with lifetime
LI Zhigang;,ZHANG Feifei;

..............page:104-107