Analysis of IMC thickness and microstructure of Sn-3Ag-0.5Cu/Ni micro-joint after multi-reflow
LIU Chao;MENG Gongge;SUN Fenglian;GU Baisong

..............page:67-69

Research on micro solder joint shear strength and fracture of Sn-3.0Ag-0.5Cu/Ni/Cu
GU Baisong;MENG Gongge;SUN Fenglian;LIU Chao;LIU Haiming

..............page:70-72,76

Research progress of red titanate phosphors for white LEDs
LU Zhou;ZHANG Le;HAN Pengde;WANG Lixi;ZHANG Qitu

..............page:1-7

Study of electromigration behavior on Sn-based solder joints under thermal cycling
YAO Jia1;GUO Fu2;ZUO Yong2;MA Limin2

..............page:73-76

Study on the thixotropy of conductive silver adhesive
CAO Xiuhua;XIONG Kang

..............page:77-79

Research on electromagnetic interference in near-zone field of PCB
ZHAO Lianqing;CHEN Yuanxun;DUAN Xiaomeng

..............page:80-83

Research progress of 1D ZnO-based gas-sensing materials
WEI Shaohong;ZHANG Youjuan;CHEN Jing

..............page:8-12

Research progress of electrically conductive adhesives
LIU Xinying;XIANG Xiongzhi;BAI Xiaojun

..............page:13-17

Influence law of thermal stress on the delamination of MEMS components
LIU Jiakai1;QI Xinglin1;WANG Bo2

..............page:84-87

ji yu chuan gan qi de ke ran xing qi ti xie lou bao jing qi she ji

..............page:12

zhong guo dao dian gui xiang jiao shi chang huo jiang xi pai

..............page:17

wen du chuan gan qi zai wei bo lu zhong de sheng ji huan dai

..............page:49

si bu wei lian he fa bu jia kuai tui jin chuan gan qi ji zhi neng hua yi qi yi biao chan ye fa zhan xing dong ji hua

..............page:53

xin neng yuan di er tiao zhan xian : zhong guo qing ran liao dian chi diao dui

..............page:61

2013 nian e luo si guo ji han jie zhan lan hui

..............page:76

Research on the method for the construction of the index system of the application verification for the astronautic components
FAN Xiaoming1;QUAN Li2;ZHANG Yanwei1;JIANG Lidong3;YU Mingjie4

..............page:18-21,25

Structural,electric properties of multiferroic（1–x）BiFeO₃-xBaTiO₃ ceramics
DAI Haiyang;CHEN Zhenping;XUE Renzhong;LI Tao;XU Jifeng

..............page:22-25

Effects of composite sintering additives low temperature sintering and properties of ZnNb₂O₆ ceramics
YAN Zhong;HUANG Jinliang;GU Yongjun;LI Qian

..............page:26-29

Suitability of Li₂MgSiO₄ microwave dielectric ceramics for low temperature sintering
LI Ran;WANG Xiao;MA Tao;WANG Hui

..............page:30-32,41

Dielectric properties and grain boundary characteristic of Cu-doped-CaCu₃Ti₄O₁₂ ceramics
MO Xingchan1;WEI Xiaoyuan1;WEI Chengfeng2;ZHENG Shaoying1;QIN Yuandong3;LIU Laijun1 Co.;Ltd;Shenzhen 518103;Guangdong Province;China; 3.Guangxi New Future Information Industry Co.;Ltd;Beihai 536000;Guangxi Zhuangzu Zizhiqu;China;)

..............page:33-36

Observation of breakdown phenomenon of middle-high voltage ceramic capacitor materials by means of high-speed video camera
CHEN Yiling;ZHANG Fan;GE Guibing;ZHUANG Jianyong;HUANG Jintao

..............page:37-41

Optimization design based on the high voltage ceramic capacitor discharge circui
YIN Rui1;DONG Xingang2

..............page:42-45

Research of modification of the Mg-Al-Cr-Fe series high temperature NTC thermistors
YANG Tao;ZHONG Chaowei

..............page:46-49

Gas sensing characteristics of one dimension nanosized SnO₂ sensor in transformer oil detection
LI Yanqiong1;ZENG Wen2;3;XIE Guoya1

..............page:50-53

Study of magnetic and electrical transport properties in La_0.67Sr_0.33MnO₃ nano-compacts
CHANG Chun1;TANG Yankun2

..............page:54-57

Preparation of Ni_0.5Co_0.5Fe₂O₄ nanocrystals by sol-gel method using spent Ni-MH batteries as resourse materials
XI Guoxi;DUN Changwei;XU Huidao

..............page:58-61

Influence of different carbon sources on the electrochemical performance of Li₂FeSiO₄/C synthesized by carbothermal reduction method
ZHANG Zheng;LIU Xingquan;MA Shensi;KOU Dan;CHEN Kai

..............page:62-66