Electronic Components & Materials 2009 Issue 5 Effects of semiconductor technology on the development of passive electronic components

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Electronic Components & Materials
1001-2028
2009 Issue 5

Effects of semiconductor technology on the development of passive electronic components
ZHANG Yaoxi

..............page:1-4

Microstructure and electric properties of BaSnO3/BaBiO3 composite ceramics
HUANG Jin;LIU Xinyu;LI Chuan;WANG Yang

..............page:5-7

Effect of Na+-doped amount on the NTC characteristics of the BaBiO3 based ceramics
LI Chuan;LIU Xinyu;SHI Yu;WANG Xiaojun

..............page:8-10

Research progress of tunnel growth in aluminum foil for capacitor
FU Chengbing;XIAO Rengui;YAN Kangping

..............page:77-80

Study on dynamics simulation and reliability of solder joints of rigid-flex backplane
SHI Jinghui;WU Zhaohua;HUANG Chunyue

..............page:73-76

Reliability sensitivity analysis of the QFN device based on Monte Carlo method
LI Yongli;ZHOU Dejian;HUANG Hongyan

..............page:69-72

Influence of sulfurization temperature on optoelectric properties of SnxSy thin films
LAI Songlin;CHENG Shuying;PENG Shaopeng

..............page:65-68

Synthesis of amorphous manganese dioxide by thiourea as reductant and its electrochemical properties
HAN Enshan;CHEN Jianing;SONG Yunpin;WANG Chenxu

..............page:62-64

Study on etching process of special high voltage anodic foil for aluminum capacitor
CHI Hui;HONG Tao;ZOU Daobing

..............page:58-61

Influence of sintering temperature on electrical properties of Ti-rich CaCu3Ti4O12 ceramics
CHEN Dong;LIU Min;ZHOU Hongqing;ZHU Haikui

..............page:54-57

Low temperature sintering and dielectric properties of CaO-Li2O-Sm2O3-TiO2 ceramics doped with Li2O-B2O3-SiO2 glass
LI Feilong;HUANG Jinliang;YANG Liushuan;GU Yongjun;LI Qian

..............page:50-53

Study on glass-forming regions and performance of CaO-SiO2-B2O3 system
XU Guijun;ZHOU Hongqing;ZHU Haikui;CHEN Dong;LIU Min

..............page:47-49

Thermal analysis for a board-level circuit module based on orthogonal test
LIU Xulei;ZHOU Dejian;HUANG Chunyue;LI Yongli

..............page:43-46

Alloys structure and mechanical properties of SnAgCu solder
SHEN Hao;TAI Feng;GUO Fu;SHI Yaowu

..............page:39-42

Research on preparation of AlN thin films preferentially orientated to c-axis
NING Jinye;LIU Xingzhao;DENG Xinwu

..............page:36-38

Study on activator for SMT lead-free electronic solder paste
CHEN Haiyan;ZHANG Haiyan;HUANG Yifan;ZHEN Chuqian

..............page:33-35

Effect of Li+ dopant on the electrical properties and energy band structure of ZnO varistor ceramics
WANG Fading;KANG Xueya

..............page:30-32

Hydrothermal preparation and gas sensing properties of CuO nanorods
ZHANG Juan;YUAN Hao;XIANG Qun;XU Jiaqiang

..............page:27-29

Dielectric percolation and solid-state reaction of the CaCu3Ti4O12-ZnNb2O6 composite materials
LIANG Xiaojun;GONG Huiling;LI Wang;HUANG Weijun;LIU Yu

..............page:24-26,29

Anatase TiO2 prepared by hydrothermal method and its photodegradation on formaldehyde under UV
ZHANG Yibing;WANG Jian;JIANG Lei

..............page:20-23

Effect of SiO2 on the structure and magnetic properties of nanosized CoFe2O4
CHEN Jingyan;LIU Mei;HUA Jie;YIN Jizhe;LI Haibo

..............page:17-19

Study on the performance of (Na0.5K0.5-xLix)NbO3 high-temperature lead-free piezoelectric ceramics
WANG Jinfeng;QI Peng;WANG Chunming;ZHENG Limei;GAI Zhigang

..............page:14-16

Effects of annealing temperature on microstructure and electromagnetic characteristics of FeSiAl alloy
GAO Feng;LI Pengfei;WANG Qun

..............page:11-13