1001-2028
2009 Issue 1
xin chun ji yu
zhong cai xia
zhong cai xia
..............page:插一
The properties of PNiTa-PZT ternary system piezoelectric ceramics
LI Qingli;CAO Jianxin;ZHAO Liyuan;GAO Chuanping;FAN Guanfeng
LI Qingli;CAO Jianxin;ZHAO Liyuan;GAO Chuanping;FAN Guanfeng
..............page:1-3
Effects of substitution of Li+ for Bi3+ on the dielectric properties of BZN ceramics
ZHANG Dong;DING Shihua;SONG Tianxiu;YANG Xiuling
ZHANG Dong;DING Shihua;SONG Tianxiu;YANG Xiuling
..............page:4-7
Sintering of borosilicate glass/Al2O3 material for LTCC
CHEN Xingyu;ZHANG Weijun;DU Yongguo;ZHENG Xiaohui
CHEN Xingyu;ZHANG Weijun;DU Yongguo;ZHENG Xiaohui
..............page:8-10
Study on ultra-fine (Ba, Sr)TiO3 ceramic for capacitors doped with Y2O3
GUAN Hao;WANG Luming;JIANG Song
GUAN Hao;WANG Luming;JIANG Song
..............page:11-13
Activated carbon as supercapacitor electrode material prepared by template method
WANG Renqing;FANG Qin;DENG Meigen
WANG Renqing;FANG Qin;DENG Meigen
..............page:14-16
Type CCF AC chip ceramic capacitors molded with epoxy resin
LUO Shiyong;ZHAO Junbin;ZHANG Shiying
LUO Shiyong;ZHAO Junbin;ZHANG Shiying
..............page:17-19
Influence of impregnation technology on the property of winding-solid polypyrrole aluminum electrolytic capacitor
LIU Xiange;YAN Wei;FENG Jiangtao
LIU Xiange;YAN Wei;FENG Jiangtao
..............page:20-22
Study on preparation and gas-sensing properties of Ni-doped α-Fe2O3 nanomaterials
LOU Xiangdong;LI Xinli;ZHAO Xiaohua;LI Guoqiang;NIU Xinshu
LOU Xiangdong;LI Xinli;ZHAO Xiaohua;LI Guoqiang;NIU Xinshu
..............page:23-25
Study on the hybrid supercapacitor with multianode
ZHANG Xingwei;JIN Zhenxing;LI Wensheng;TA Na;NING Tao
ZHANG Xingwei;JIN Zhenxing;LI Wensheng;TA Na;NING Tao
..............page:26-27,30
Effects of oxygen concentration on surface morphology and microstructure of ZnO thin films
XIAO Hui;XU Haning;ZHU Chang
XIAO Hui;XU Haning;ZHU Chang
..............page:28-30
Influence of flattening on the structure and electromagnetic characteristics of FeSiAl alloy
GAO Feng;LI Pengfei;WANG Qun
GAO Feng;LI Pengfei;WANG Qun
..............page:31-33
Preparation of Co-ferrite doped with Nd3+ from spent lithium ion batteries through hydrothermal method
XI Guoxi;XING Xinyan;FAN Renxiu;LU Maixi
XI Guoxi;XING Xinyan;FAN Renxiu;LU Maixi
..............page:34-36
Surface treatment and performance of silicate LED phosphor
WEN Jiaqi;WANG Xifeng;BIAN Fuqiang;XIA Wei
WEN Jiaqi;WANG Xifeng;BIAN Fuqiang;XIA Wei
..............page:37-39
Analysis of the interface crack for QFN devices in hygro-thermal ambient
DU Chao;JIANG Tingbiao;NONG Hongmi
DU Chao;JIANG Tingbiao;NONG Hongmi
..............page:40-43
Influences of Sm3+-doped amount on the magnetic properties of Co2Z hexaferrite in ultra-high frequency region
YAO Jing;YU Lihua;XU Dandan
YAO Jing;YU Lihua;XU Dandan
..............page:44-45,52
Preparation of Cd-doped LaFeO3 gas-sensing materials by sol-gel method
GE Xiutao;LI Yonghong;LIU Xingqin
GE Xiutao;LI Yonghong;LIU Xingqin
..............page:46-48,52
Influence of carbon pyrolyzed from sucrose on structure and performance of LiFePO4
WANG Zhigao;LI Jianling;WANG Luoying;GAO Fei;WANG Xindong
WANG Zhigao;LI Jianling;WANG Luoying;GAO Fei;WANG Xindong
..............page:49-52
Electric characteristic simulation for thick film fuse
LI Jiliang;DENG Hong;LIU Lijian
LI Jiliang;DENG Hong;LIU Lijian
..............page:53-55
Analysis of thermal stress and hygrothermal stress for SiP device in reflow soldering
JIANG Haihua;MA Xiaosong
JIANG Haihua;MA Xiaosong
..............page:56-59
Influence of combining thermal-humidity and vapor pressure on the reliability for plastic packaging device
CAI Miao;YANG Daoguo;ZHONG Lijun
CAI Miao;YANG Daoguo;ZHONG Lijun
..............page:60-63
A prospect and essay of bioceramics
ZHU Binghe;ZHU Yingquan
ZHU Binghe;ZHU Yingquan
..............page:64-67
Research progress of nanomaterials prepared by laser ablation in liquid mediums
LIU Peisheng;ZENG Haibo;CAI Weiping;LUO Xiangdong;JING Weiping
LIU Peisheng;ZENG Haibo;CAI Weiping;LUO Xiangdong;JING Weiping
..............page:68-72