Electronic Components & Materials 2008 Issue 1 bian du tong xin

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Electronic Components & Materials
1001-2028
2008 Issue 1

bian du tong xin

..............page:Ⅱ,Ⅳ

zong he xin xi

..............page:25,31,44,57

Development of aluminum electrolytic capacitors for green lighting
LIANG Ya-qin

..............page:51-53

Preparation of a novel NO2 gas sensor based on SnO2 thick film
LIN Jin-yang

..............page:48-50

Effect of TiCN on properties for (Ba0.85Sr0.11Pb0.04) TiO3-based PTC thermistor ceramics
ZHENG Jin-qing;ZHAO Rui-hong

..............page:45-47

Study on preparation of BaNd2Ti4O12 microwave dielectric ceramics via polymeric precursor
GAO Hui-juan;XU Jian-mei;WANG Hui

..............page:41-44

Design of broadband microstrip antenna using double negative metamaterial
WANG Zhen-yu;ZHAO Hui-ling;SHEN Jing;MA Feng-jun

..............page:38-40

Effect of Mn in HDDR anisotropic NdFeCoB magnetic powder
LIN Pei-hao;CHEN Xu;CHENG Jun;ZHOU Xiu-juan

..............page:35-37

Effect of substitution of Sn4+ for Nb5+ on properties of Bi2(Zn1/3Nb2/3)2O7-based ceramics
ZHANG Hong-xia;DING Shi-hua;CHEN Tao;SONG Tian-xiu;ZHANG Dong

..............page:32-34

Effect of thermal input and Ni doping on strength in Sn-Ag solder
NIE Jing-kai;ZHANG Bing-bing;GUO Fu;XIA Zhi-dong;LEI Yong-ping

..............page:29-31

Pretreatment of electronic components/devices lead frame and determination of Cr6+
CHEN Zhi-dong;TONG Wei-li;WANG Wen-chang;KONG Yong;MITSUZAKI Naotoshi

..............page:26-28

Study on performance of AlN-TiC composites with microwave attenuation characteristics
CHENG Wei-hua;LI Xiao-yun;QIU Tai;JIA Miao-lei

..............page:23-25

Synthesis of spherical microfine nickel powders with RF plasma
BAI Liu-yang;YUAN Fang-li;HU Peng;LI Jin-lin;TANG Qing

..............page:20-22,57

Study of a VOC-free flux for lead-free solder
ZHANG Bing-bing;LEI Yong-ping;XU Dong-xia;LI Guo-wei;XIA Zhi-dong

..............page:16-19

All-tantalum wet electrolytic capacitor with all-sealing structure
WANG Xiu-yu;LIU Zhong-e;ZHANG Zhi-sheng;Bai Tian;HUANG Xiang-dong

..............page:13-15

Research progress of properties for glass-coated magnetic alloy microwires
DI Yong-jiang;JIANG Jian-jun;BIE Shao-wei;TIAN Bin;HE Hua-hui

..............page:8-12

Some explanation of formed reasons for waste product in PTC component manufacture
ZHU Bing-he;ZHU Ying-quan

..............page:1-7

xin chun ji yu
zhong cai xia

..............page:Ⅰ

Study on interface and shear behavior in lead-free solder joint
DING Ya-ping;QI Fang-juan;SUN Li;YANG Ming-hui

..............page:74-76

Effects of moisture diffusion and hygrothermal stress on reliability of SCSP
YE An-lin;QIN Lian-cheng;KANG Xue-jing

..............page:69-73

Thermal reliability analysis of package in PBGA
LI Chang-geng;LIN Dan-hua;ZHOU Jie-min

..............page:65-68

Study on interfacial delamination of FCOB under thermal cycle loading
SU Xi-ran;YANG Dao-guo;ZHAO Peng;GUO Dan

..............page:62-64

AlN/SiO2-B2O3-ZnO-Bi2O3 low temperature co-fired glass ceramics
ZHAO Hong-sheng;GAO Nian-zi

..............page:58-61

Application of low dissipation factor MLCC in RF circuit
GUI Di;SUN Fei;LIN Zeng-jian

..............page:54-57