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Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronic Components & Materials
1001-2028
2003 Issue 2
chan pin dao gou
..............page:53
Reliability Analysis of Mixed Conductor LTCC Substrate
wang zheng yi
..............page:7-9
Design of a New Universal Active Current Mode Filter
zhou ying hua ; xiong yuan xin ; sun li ping ; zhou wei tao
..............page:4-6,9
Study on Microwave Attenuation Characteristics of AlN-C Composites
bu wen bo ; qiu tai ; xu jie ; shen chun ying
..............page:1-3
A Novel Jig for Aging Discrete SMDs
zhang jian cheng ; zhu xi yi
..............page:48-49
Flip-Chip Assembly in Thermal Cycle: Effects of Residual Stress Due to Cure on the Thermo-mechanical Reliability
liu shi long ; qin lian cheng ; yang dao guo ; hao xiu yun
..............page:44-47,49
Gel Casting Technology for High Voltage Ceramic Capacitors
pu yong ping ; chen shou tian
..............page:41-43
Status of Study on BST-based Phase Shifter Materials
jin yu long ; zhou hong qing ; wu hong zhong ; liu min ; jiang wei bo ; huang zhi wen
..............page:38-40
The Application of Epoxy Resin to the Electronic Encapsulation
li xiao yun ; zhang zhi sheng ; cao jun feng
..............page:36-37
Breakdown-voltage Test Module for Discharging-tubes
chen wei bing ; lv wen zhong ; li bu yin
..............page:31-33
The Improvement of MgTiO3 Dielectric Ceramics
tao feng zuo ; ge di yun ; zhang huo rong
..............page:28-30
Research on the Piezo-ceramic Filter: Low Insertion Loss, Narrow Band, 10.7 MHz
han zuo yan ; chen qiang ; xue zhong jing ; cai rong yang
..............page:24-27
NET2270 USB2.0 Peripheral Controler and the System Desigh
xu jia zuo ; wang wei lin ; zhu jie
..............page:20-23,27
The Housing of Aluminum Silicon Carbide for T/R Modules
xiong de gan ; liu xi cong ; zhao zuo ; zhuo zuo
..............page:17-19
Recent Advances in the Study on Electrochemical Capacitors I. Electric Double-layer Capacitors
yang hong sheng ; zhou xiao ; feng tian fu ; tang xiao ping
..............page:13-16,19
The Study on the Effect of the Printing and Firing Process of Al Electrode in Ohmic Contact Electrode on the Final PTCR Properties
liang fei ; zhou dong xiang ; gong shu ping ; wang xiao hong
..............page:10-12