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Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronic Components & Materials
1001-2028
2002 Issue 11
Effect of Nickel Electroplating on Bending Fatigue of Leads to Metallic Packages
liu fei hua ; shen zhuo shen ; xu wei yuan
..............page:22-23,33
Passivation and Power Durability of SAW Devices
zhang chuan zhong
..............page:28-29
Progress of the Study on the Photocatalytic Activity of Nanometer TiO2
gao chun hua ; huang xin you
..............page:30-33
ispLSI1032E and Its Application
ding jia feng ; cao jian ; li xin mei
..............page:34-36
chan pin dao gou
..............page:39
Investigation on the Methods for Measuring Porosity on Gold Plating
zhou zuo lin ; zhang ji gao
..............page:19-21
Study on the Technology and Equipment for Fine Globular Silver Powder
feng yi ; meng shu zuo ; liu hui chong
..............page:16-18
The Failure Analysis of the Capacitors Used in Electronic Ballast
feng jun ; shao guo zhu
..............page:14-15,18
The Economic Practical DSP's Power Solution
sun ji ping ; guan yong ; zhang jie
..............page:11-13
Preparation and Properties Research of Transparent Conductive ZnO:Al(ZAO)Thin Films
huang jia mu ; dong jian hua ; zhang xin yuan
..............page:7-10,13
Study on Sintering Processes of Chip PTCR Formed by Roll Process
chen yan ; gong shu ping ; zhou dong xiang
..............page:4-6
Effects of Nd Dopant on the Electrical Properties of SnO2·Co2O3·Nb2O5-based Ceramics for Varistors
zuo peng ; wang zuo feng ; chen hong cun ; gao zuo ; gao jian lu
..............page:1-3,6