Electro-Mechanical Engineering 2005 Issue 1 Design Review of Radar Radome Assembly Technology

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Electro-Mechanical Engineering
1008-5300
2005 Issue 1

Design Review of Radar Radome Assembly Technology
ZHOU Jin

..............page:41-43,55

Microwave Modules's Assembling Welding Spot and Its Reliability
WU Yi;ZHONG Jian-feng;ZHANG De-ming

..............page:44-45,63

Application of Integrated Design & Manufacture Technology for Communication Antenna ODU
ZHANG Xuan-li;MA Jin-cang

..............page:46-48

A Simplified Analysis of Vacuum Aluminum Brazing Clamp Design
JIA Jian-zhong;DAI Shui-qing

..............page:49-51

"Tri-lization" Design of Small Monopulse Secondary Radar
GUO Yue-xia

..............page:26-28

Structure Design of a High Accuracy Double Curvature Antenna System
ZHOU Jun;LI Ming-rong

..............page:29-31

Some Problems of Accuracy for Grid Type Reflecting Surface of Circular Paraboloid Antenna
XIAO Wan-xuan

..............page:32-36

Analysis and Comparion between the Testing Modal and the Theoretical Analysis Modal of an Antenna Pedestal
ZHANG Xiao-an;ZHang Yan

..............page:37-40

icima2004 guo ji xue shu hui yi zhui ji

..............page:59

Design of a Door-entry Control System Based on Code Hopping Encoder and MCU P87LPC764
CHEN Ping;YU Jian-ping

..............page:60-63

Analysis of Electromechanical Dynamics of a Piezoelectric Servo-device
JIA Jian-yuan;YANG Jing;ZHANG Ai-mei

..............page:56-59

Research and Development of Automatic Measurement System of Heat Sink Thermal Resistance Based on LabVIEW
LU Qiang

..............page:52-55

A Study on Improving the Mobility, Reliability, Maintainability and Supportability of Vehicle-based Air Defense Radar from Structural Design Point of View
HU Chang-ming

..............page:1-4

Research and Development Frend of MEMS Technology
YU Dan-ming;LIANG Li-hua;XU Yang-jian

..............page:5-9

An Experimental System of Heat Exchanging for Testing Microchannels
WANG Hong-xi;KANG Chun-xia;JIA Jian-yuan

..............page:10-13

Application of Icepak in the Thermal Design of an Electronic Device
CHEN Jie-ru;ZHU Min-bo;QI Ying

..............page:14-16

Structure EMC Design of AV4061 Spectrum Analyzer
WANG Wei

..............page:17-19

Analysis on the Thermal Flow Resistance of a Convectional Microchannel Heat Exchange Control System
KANG Chun-xia;HUANG Xin-bo;LIU Huan-ling

..............page:20-21,36

Steady State and Transient Thermal Analysis of Airborne Electronic Components
PAN Xian-kun;YU Jian-zu;GAO Hong-xia

..............page:22-25,28