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Electronics Process Technology
1001-3474
2016 Issue 4
Hydrogen Used for Synthesis of High Purity SiC Powder for Growth of SiC Crystal
MA Kang-fu;,WANG Ying-min;,LI Bing;,WEI Ru-sheng;
..............page:187-190
New Assembly Process Discussion Based on SMT
ZHAO Shao-wei;,ZHANG Jing-liang;,HAN Chun;
..............page:191-195
Research and Analysis of End Tin Layer Extension of Ni Electrode MLCC after Plating
ZENG Yu;,WANG Hai-yang;
..............page:196-197,204
Application of Epoxy Automatic Mounting Technology to GaAs Bare Die
XUAN Xiang;,SONG Xia;,LIN Wen-hai;
..............page:198-200
Study of ESD Endurance of Buried Thin Film Resistor in Printed Circuit Board
FANG Jun-liang;,CHEN Xiao-fei;,SHI Rui-zhi;
..............page:205-209,224
Effect of Microwave Printed Circuit Board Material on Pad
ZHANG Chao-dong;
..............page:210-212,248
Research and Solution of Gull-wing Lead Oxidation Problem of SMD Device
ZHANG Yun;,WU Xiao-yue;,PI Xiu-guo;,WEI Feng-zhi;,CHEN Jin-long;
..............page:213-216
Ultrasonic Cleaning Process for Microwave Multi-Chip Module
LI Hui;,CUI Hong-bo;,GUO Qian;
..............page:217-219,238
Refl ow Profi le of Large Heat Capacity PCB With Small Devices
SUN Qi;,CHEN You-zhen;,YU Shu-bao;,CAO Hong-sheng;
..............page:220-224
Automatic SMT Process Research of Microwave Multi-channel TR Assembly
LIU Bo;,CUI Hong-bo;,HOU Xiang-zhao;
..............page:225-227,248
Inline Cutting Process and Key Technology for TFT-LCD Q-Panel
LI Qing-liang;,CAI Ke-xin;,WANG Min;,WU Li-hong;
..............page:236-238
Effect of Sucker on Punching Accuracy
WANG Hai-zhen;,YANG Wei;,SI Ying-jun;,DI Xi-yuan;,DONG Yong-qian;
..............page:243-245,248
Management of Green Supply Chain in Electronic and Electrical Products (continued)
JIA Bian-fen;,LV Shu-zhen;
..............page:246-248