1001-3474
2016 Issue 1
Design of Fluorescent Lamp Which LEDs Posted Outside Glass
LIU Zheng;,YANG Zhuo-ran;,OU Yan-jie;,WU Yi-ping;
LIU Zheng;,YANG Zhuo-ran;,OU Yan-jie;,WU Yi-ping;
..............page:1-3,16
Review on Detection of Bond Wires in Electronic Components
Qi Yi;,CHEN Wei-min;,LIU Xian-ming;
Qi Yi;,CHEN Wei-min;,LIU Xian-ming;
..............page:4-10
Welding Crack Analysis and Optimization of LTCC Chip
TAN Ji-yong;,ZHANG Qiang;,LIU Bing;
TAN Ji-yong;,ZHANG Qiang;,LIU Bing;
..............page:11-16
RF SiP Design Based on Silicon Integrated Passive Device
LUO ming;,WANG Gui-chang;,LIU Chang-jiang;,ZHANG Zheng-hong;
LUO ming;,WANG Gui-chang;,LIU Chang-jiang;,ZHANG Zheng-hong;
..............page:17-20
Reliability Analysis of lead-free QFN Packages in Mixed Assembly
ZOU Jia-jia;,SUN Xiao-wei;,CHENG Ming-sheng;
ZOU Jia-jia;,SUN Xiao-wei;,CHENG Ming-sheng;
..............page:21-23,31
..............page:24-27
Research on Process of Laser Seal Welding Technology for Microwave Module
CHEN Cheng;,WANG Hong-lin;,SUN Hu-hao;,WANG Cheng;
CHEN Cheng;,WANG Hong-lin;,SUN Hu-hao;,WANG Cheng;
..............page:28-31
BGA Soldering Quality Detection Techniques by X Ray Imaging
HE Zhi-gang;,LIANG Kun;,ZHOU Qing-bo;,GONG Guo-hu;,WANG Xiao-min;
HE Zhi-gang;,LIANG Kun;,ZHOU Qing-bo;,GONG Guo-hu;,WANG Xiao-min;
..............page:32-34,39
Study and Development of Millimeter Wave RF MEMS Switch
DANG Yuan-lan;,ZHAO Fei;,LIANG Guang-hua;,LIU Xiao-lan;,XU Ya-xin;
DANG Yuan-lan;,ZHAO Fei;,LIANG Guang-hua;,LIU Xiao-lan;,XU Ya-xin;
..............page:35-39
Analysis of Infl uence of Bond Pads at Different Height to Wire Bond Pull
LIU Yuan-ping;,REN Lian-feng;
LIU Yuan-ping;,REN Lian-feng;
..............page:40-42,59
Assembly Process for New Type of RF Connector
WU Min;,ZHANG Liu-niu;,JIANG Qing-lei;
WU Min;,ZHANG Liu-niu;,JIANG Qing-lei;
..............page:43-45,49
Infl uence of Environment Test on Soldering Reliability of Micro Elements
WANG Bin;,LI Hong-wei;,MO Xiu-ying;,ZHAO Hai-lun;
WANG Bin;,LI Hong-wei;,MO Xiu-ying;,ZHAO Hai-lun;
..............page:46-49
Wire Bonding at Quite Small Bonding Pad
SUN Rui-ting;
SUN Rui-ting;
..............page:50-52,55
Application Research on UV Laser Machining for Aluminum Foil
WANG Chuan-wei;,LEI Dang-gang;,LIANG Ning;,FANG Kun;,YANG Jing-hui;,QIU Han;
WANG Chuan-wei;,LEI Dang-gang;,LIANG Ning;,FANG Kun;,YANG Jing-hui;,QIU Han;
..............page:53-55
Research on Dynamic Signal Acquisition Method and Innovation Processing Equipment
HE Xing;,ZHOU Min;,ZHOU Li-li;,XU Bing-qing;,DAI Chen;,ZHANG Ping;
HE Xing;,ZHOU Min;,ZHOU Li-li;,XU Bing-qing;,DAI Chen;,ZHANG Ping;
..............page:56-59
Cleaning Technology for PCBA in Electronics Assembly(continued)
SHI Jian-wei;,SUN Lei;
SHI Jian-wei;,SUN Lei;
..............page:60-62