1001-3474
2015 Issue 4
Reliability Studies of Sn-3.0Ag-0.5Cu Solder Joints
SUN Lei;,ZHANG Liang;,ZHONG Su-juan;,MA Jia;,BAO Li;
SUN Lei;,ZHANG Liang;,ZHONG Su-juan;,MA Jia;,BAO Li;
..............page:187-190,202
Fast Epitaxial Growth Process on 4 Degree Off-cut 4H-SiC Wafers
MAO Kai-li;,WANG Ying-min;,LI Bin;,ZHAO Gao-yang;
MAO Kai-li;,WANG Ying-min;,LI Bin;,ZHAO Gao-yang;
..............page:191-193
wei xi tong ji shu ying yong qian jing guang kuo -- xie zai wei xi tong ji shu lan mu kai bi zhi ji
hao ji shan ;
hao ji shan ;
..............page:194-194
Development Trends and Challenge Towards Integration Technology of Micro System Module
LIU Zhi-hui;,WU Ming-yuan;
LIU Zhi-hui;,WU Ming-yuan;
..............page:195-198
Exploration of System Engineering Methodology in Micro-System Design
JIN Chang-lin;,HAO Ji-shan;,LUO Hai-kun;
JIN Chang-lin;,HAO Ji-shan;,LUO Hai-kun;
..............page:199-202
Application of Potting Process in Reinforcement of Tail Connector
WANG Yu-long;,SHI Bao-hong;,LI Jing-qiu;
WANG Yu-long;,SHI Bao-hong;,LI Jing-qiu;
..............page:203-207
Application of Flying Probe Tester in Digital T/R Unit Test
DENG Wei;,JIANG Qing-lei;,LIU Gang;,FANG Xun-lei;
DENG Wei;,JIANG Qing-lei;,LIU Gang;,FANG Xun-lei;
..............page:208-210,218
Effect of Gold Powder and Glass Powder on Properties of Thick Film Gold Conductor Paste
ZHAO Ying;,ZHANG Jian-yi;,LU Dong-mei;,ZHAO Ke-liang;,SUN She-ji;
ZHAO Ying;,ZHANG Jian-yi;,LU Dong-mei;,ZHAO Ke-liang;,SUN She-ji;
..............page:211-213,218
Research on reliability of Gold/Aluminum Wire Bonding on Si Chips
WANG Hui-jun;,GONG Bing;,CUI Hong-bo;
WANG Hui-jun;,GONG Bing;,CUI Hong-bo;
..............page:214-218
Research on InP HEMT Low Noise Device for 3 mm Frequency Band
LIAO Long-zhong;,ZHANG Li-jiang;,SUN Xi-guo;,CUI Yu-xing;,FU Xing-chang;
LIAO Long-zhong;,ZHANG Li-jiang;,SUN Xi-guo;,CUI Yu-xing;,FU Xing-chang;
..............page:219-221,248
Study on Process Technology of 0.25μm High Precision T Gate
SUN Xi-guo;,CUI Yu-xing;,FU Xing-chang;
SUN Xi-guo;,CUI Yu-xing;,FU Xing-chang;
..............page:222-224
Research of Microwave Power Die Vacuum Soldering Technique
LUO Tou-ping;,KOU Ya-nan;,CUI Hong-bo;
LUO Tou-ping;,KOU Ya-nan;,CUI Hong-bo;
..............page:225-227
Study on Aqueous Cleaning Technology for PCB Assembly
LIN Xiao-ping;,FU Wei-lin;
LIN Xiao-ping;,FU Wei-lin;
..............page:228-230,237
Infl uence of Laser Parameters on Surface Modality and Gas Tightness of Si-Al Alloy Shell
wang chuan wei ;, lei dang gang ;, liang ning ;, hu jun ;, song xia ;, yang jing hui ;, fang kun ;
wang chuan wei ;, lei dang gang ;, liang ning ;, hu jun ;, song xia ;, yang jing hui ;, fang kun ;
..............page:231-233
..............page:234-237
Die Surface Design of SPF Based on Golden Section Method
SHAO Zong-ke;,YIN Dong-ping;,DU Xiong-yao;,ZHANG Chong;
SHAO Zong-ke;,YIN Dong-ping;,DU Xiong-yao;,ZHANG Chong;
..............page:238-241
Attachment Technology Analysis of Flat Panel Display Devices
FENG Zhen-hua;
FENG Zhen-hua;
..............page:242-244
Cleaning Technology for PCBA in Electronics Assembly
SHI Jian-wei;,SUN Lei;
SHI Jian-wei;,SUN Lei;
..............page:245-248