1001-3474
2015 Issue 1
Thermal Performance of Glass Tube LED Module
WANG Fen-cheng;,WU Yi-ping;,YANG Zhuo-ran;
WANG Fen-cheng;,WU Yi-ping;,YANG Zhuo-ran;
..............page:1-3,62
Review on Latest Advances of Sn-Zn-X Solder Joints
SUN Lei;,ZHANG Liang;
SUN Lei;,ZHANG Liang;
..............page:4-11
Study on Local Recrystallization and Damage Mode of Lead-free BGA Solder Joint
CHEN Gai-qing;,CHENG Ming-sheng;,XU Xing;
CHEN Gai-qing;,CHENG Ming-sheng;,XU Xing;
..............page:12-14,24
Large Area Soldering Technology Research of Substrate with High Soldering Rate
BAO Xiao-yun;,GAO Li-li;,TANG Huai-ming;,WANG Li-hong;
BAO Xiao-yun;,GAO Li-li;,TANG Huai-ming;,WANG Li-hong;
..............page:15-17,41
Soldering Fault Analysis of Connectors
HE Rui;,JIAO Chao-feng;,REN Kang;,ZHANG Ya-ni;
HE Rui;,JIAO Chao-feng;,REN Kang;,ZHANG Ya-ni;
..............page:18-20,44
Crystal Modelling Method for Shrinking Factor of Solder Paste During Pin-in-Paste Solder Process
SUN Shou-hong;,WANG Yu-long;,ZHANG Yan-peng;
SUN Shou-hong;,WANG Yu-long;,ZHANG Yan-peng;
..............page:21-24
Study on Heavy Aluminum Wire Bonding in Power VDMOS Devices
HE Zong-peng;,WANG Ning-ning;,ZHANG Bin-bin;,ZHANG Zhen-ming;
HE Zong-peng;,WANG Ning-ning;,ZHANG Bin-bin;,ZHANG Zhen-ming;
..............page:25-28
Influence Factors on Wet-Heat Resistant Property of Three Proofing Coating of Military Electronic PCBA
YANG Tang-shao;,ZHANG Hong-bing;,ZHONG Fu-xian;
YANG Tang-shao;,ZHANG Hong-bing;,ZHONG Fu-xian;
..............page:29-31,54
..............page:32-33,50
Research on Assembly Process for High-density and Ultramulti-pin Connectors
HE Dong-mei;,XIAO Jian-feng;,ZHANG Tao;
HE Dong-mei;,XIAO Jian-feng;,ZHANG Tao;
..............page:34-37
Study on Semi-aqueous Cleaning Technology of Microwave Module
CHEN Liang;,CUI Hong-bo;
CHEN Liang;,CUI Hong-bo;
..............page:38-41
Assembly Research of Multilayer Ceramic Capacitors in Microwave Modules
CHEN Yi-gang;,DAI Li-qiang;,LAN Bo;,SHAO Deng-yun;
CHEN Yi-gang;,DAI Li-qiang;,LAN Bo;,SHAO Deng-yun;
..............page:42-44
..............page:45-46,58
Preparation and Dielectric Properties of Zinc Magnesium Titanate Dielectric Ceramics
FU Zhen-xiao;,MO Fang-ce;,SONG Yong-sheng;,TANG Hao;,ZHANG Huo-guang;
FU Zhen-xiao;,MO Fang-ce;,SONG Yong-sheng;,TANG Hao;,ZHANG Huo-guang;
..............page:47-50
Silicone Gel Encapsulation Process Design and Improvement of High-Voltage Module
CAO Long-bo;,DAI Wen-feng;,FENG Chuan-jun;,WANG Chuan-wei;,WANG Min-hua;,ZHANG Nan-chuan;
CAO Long-bo;,DAI Wen-feng;,FENG Chuan-jun;,WANG Chuan-wei;,WANG Min-hua;,ZHANG Nan-chuan;
..............page:51-54
Filament Winding Technology of High Rigid Carbon Fiber Rods with Large Length to Diameter Ratio
BAI Yi-feng;,WEI Sheng-wen;
BAI Yi-feng;,WEI Sheng-wen;
..............page:55-58
Manual Soldering Process Technology (continued)
DU bin;,SHI Jian-wei;,SU Li-jun;,TAN Zheng-dong;,ZHOU Xuan;
DU bin;,SHI Jian-wei;,SU Li-jun;,TAN Zheng-dong;,ZHOU Xuan;
..............page:59-62