1001-3474
2014 Issue 4
Development & Manufacture Research of Coreless Substrate for IC Packages
AN-Bing;,HOU Zhao-zhao;,HU Ya-ting;,LI Mao-yuan;,SHAO Yuan-cheng;,ZHANG-Yun;
AN-Bing;,HOU Zhao-zhao;,HU Ya-ting;,LI Mao-yuan;,SHAO Yuan-cheng;,ZHANG-Yun;
..............page:187-189,233
Effect of Temperature on Reaction Rules between Active Agent used in Lead-free Solder Paste and Solder Material of Sn0.3Ag0.7Cu
GUO Chi-chi;,GUO Jing;,WU Dao-zi;,ZHAO Mai-qun;
GUO Chi-chi;,GUO Jing;,WU Dao-zi;,ZHAO Mai-qun;
..............page:190-193,197
Image processing method for measurement of wetting angle
CHAI Wei;,FU Hong-zhi;,JIA Jian-yuan;,LIU Zhe;,WANG Shi-yu;
CHAI Wei;,FU Hong-zhi;,JIA Jian-yuan;,LIU Zhe;,WANG Shi-yu;
..............page:194-197
Low Temperature Lead-free Solders
FENG Ji-cai;,GU Xiao-long;,LIU Ping;,LONG Zheng-yi;,SONG Xiao-guo;
FENG Ji-cai;,GU Xiao-long;,LIU Ping;,LONG Zheng-yi;,SONG Xiao-guo;
..............page:198-200
Review of Deformation Behavior in Beta-tin Crysta
ZHOU Hui-ling;
ZHOU Hui-ling;
..............page:201-206
PCB Collaborative Design Based on Integrated DFM
HUANG Chun-yue;,JIANG Ping;
HUANG Chun-yue;,JIANG Ping;
..............page:207-209,248
Study on Effect of Crystal Type on Fatigue Fracture of BGA Solder Joint
CHEN Gai-qing;,CHENG Ming-sheng;,XU Xing;
CHEN Gai-qing;,CHENG Ming-sheng;,XU Xing;
..............page:210-213
Batch Production Technology of T/R Modules Based on MES
CONG Yuan-ru;,JIANG Yang;,LIU Gang;,SUN Yuan;,YAN Wei;
CONG Yuan-ru;,JIANG Yang;,LIU Gang;,SUN Yuan;,YAN Wei;
..............page:214-217
Soldering Method Research of SMD with Golding-plated Lead
CHE Fei;,WU Xia-kai;,YANG Yi-feng;,ZHOU Cheng-ping;
CHE Fei;,WU Xia-kai;,YANG Yi-feng;,ZHOU Cheng-ping;
..............page:218-221,248
CCGA Package Characteristic and it’s Applications for Space Products
CHEN He-xian;,LV Qiang;,TANG Fei;,YOU Ming-yi;,ZHANG Chao-hui;
CHEN He-xian;,LV Qiang;,TANG Fei;,YOU Ming-yi;,ZHANG Chao-hui;
..............page:222-226
..............page:227-229,241
High Reliability Assembly of CQFP
CHEN Jia-qiang;,LU Wei;,YIN Jian-ce;
CHEN Jia-qiang;,LU Wei;,YIN Jian-ce;
..............page:230-233
..............page:234-236,248
Research of n Type 4H-SiC Growth Process
DAI Xin;,HOU Xiao-rui;,LI Bin;,WANG Ying-min;
DAI Xin;,HOU Xiao-rui;,LI Bin;,WANG Ying-min;
..............page:237-238,245
Numerical study of TSV Copper Deposition with Multi-additives
SHI Kai-peng;,WEI Hong-jun;
SHI Kai-peng;,WEI Hong-jun;
..............page:239-241
Research of Cutting Process of TP Glass
LV Mo;,WANG Jian-hua;,ZHANG Fei-te;
LV Mo;,WANG Jian-hua;,ZHANG Fei-te;
..............page:242-245
Selection and Application of Component in Electronic Assembly (The end)
DU bin;,DU Jun-kuan;,SHI Jian-wei;,WANG Jian-min;
DU bin;,DU Jun-kuan;,SHI Jian-wei;,WANG Jian-min;
..............page:246-248