1001-3474
2014 Issue 2
Research on Pin Impedance of RFID Tags Packaging With ACA
FAN Zhun;,JIANG Xue-kang;,TAO Bo;,YIN Zhou-pin;
FAN Zhun;,JIANG Xue-kang;,TAO Bo;,YIN Zhou-pin;
..............page:63-65,106
Finite Element Simulation Analysis of BGA Solder Joint Nano-Indentation Experiment
DAI Hong-bin;,LIU Ge-xu;,WANG Li-feng;
DAI Hong-bin;,LIU Ge-xu;,WANG Li-feng;
..............page:66-69,97
Research on Induction Brazing Process and Design of Electrical Connectors
HUO Shao-xin;,LIU Bing-long;,XIE Qi-lin;
HUO Shao-xin;,LIU Bing-long;,XIE Qi-lin;
..............page:70-73,87
..............page:74-76,121
Process Optimization on PCB Electrical Connectors Assembling Based on Finite Element Method
WAN Chun-qing;,YANG Meng;,ZHANG Bin-bin;,Zhang Wei;
WAN Chun-qing;,YANG Meng;,ZHANG Bin-bin;,Zhang Wei;
..............page:77-79,109
..............page:80-83
..............page:84-87
Research on Cleaning Technology of Printed Circuit Assembly Bonded With Aluminum Plate
YU Shao-ying;,ZHANG Xuan;
YU Shao-ying;,ZHANG Xuan;
..............page:88-90
Microwave Integrated Technology of Thin Film on LTCC
LI Yan-rui;,LIU Zhi-hui;,QIN Yue-li;,WANG Chun-fu;,XIAO Hui;
LI Yan-rui;,LIU Zhi-hui;,QIN Yue-li;,WANG Chun-fu;,XIAO Hui;
..............page:91-93,124
..............page:94-97
Research of Bead Mill Process for Electronic Paste of Plasma Display Panel
PENG Qin-hua;,WANG Peng-nian;,ZHENG Wei;
PENG Qin-hua;,WANG Peng-nian;,ZHENG Wei;
..............page:98-102
Application of Machine Vision in Precisely Picking and Placing Chip Equipment
HOU Yi-xue;,JING Wen-li;,WANG Yan;,ZHANG Yong-cong;
HOU Yi-xue;,JING Wen-li;,WANG Yan;,ZHANG Yong-cong;
..............page:103-106
Application of Electric Punching Unit to Green Ceramic Sheet Punching Machine
DONG Yong-qian;,TIAN Fang;,WANG Gui-ping;,WANG Yan;,YANG Wei;
DONG Yong-qian;,TIAN Fang;,WANG Gui-ping;,WANG Yan;,YANG Wei;
..............page:107-109
OTT Software Encryption System Based on ALPU-M3 SOC
FAN Zi-lai;,ZHANG Bao-zhu;
FAN Zi-lai;,ZHANG Bao-zhu;
..............page:110-113,121
Research of Environment Friendly Electrical Contact Protective lubricant Instead of Gold Plated Covering on Copper and Its Alloy
DUAN lian;,JIA Cheng-lin;,ZHANG Bao-gen;
DUAN lian;,JIA Cheng-lin;,ZHANG Bao-gen;
..............page:114-121
Selection and Application of Component in Electronic Assembly (continued)
DU bin;,DU Jun-kuan;,SHI Jian-wei;,WANG Jian-min;
DU bin;,DU Jun-kuan;,SHI Jian-wei;,WANG Jian-min;
..............page:122-124