1001-3474
2013 Issue 6
DFM of Soldering Pad of QFP and DIP for Wave Soldering
WANG Tian-xi;,WANG Yu-ming;,YANG Jian-xin;
WANG Tian-xi;,WANG Yu-ming;,YANG Jian-xin;
..............page:315-319,336
FEM Analysis of Effect of LGA Solder Joint Shape on Lifetime of Solder Joints
WU Zhao-hua;,ZHAO Zhi-bin;
WU Zhao-hua;,ZHAO Zhi-bin;
..............page:320-322,327
A HV-LED Bulb with Optimization of LED String Segment
LV Wei-wen;,XU Zi-qiang;,ZHU Chao;
LV Wei-wen;,XU Zi-qiang;,ZHU Chao;
..............page:323-327
Assembly Technology of High-density Board with Lead and Lead-free Materials
JIANG Qing-lei;,LIU Gang;,WANG Xu-yan;,YAN Wei;,ZHANG Wei;
JIANG Qing-lei;,LIU Gang;,WANG Xu-yan;,YAN Wei;,ZHANG Wei;
..............page:328-332,366
FEM Analysis on Thermal Fatigue Life of CCGA Column Under Compressive Load
CHEN Jia-qiang;,GUAN Yu-hui;,LV Qiang;,YOU Ming-yi;
CHEN Jia-qiang;,GUAN Yu-hui;,LV Qiang;,YOU Ming-yi;
..............page:333-336
Process Evaluation for Lead-free Reflow Soldering Equipment Configuration
DU Bin;,LIAO Ting;,SHI Jian-Wei;,WANG Ling;,WANG Wei;
DU Bin;,LIAO Ting;,SHI Jian-Wei;,WANG Ling;,WANG Wei;
..............page:337-341,366
Research on Reliability of Au-Al Bonding-interface Affected by Electrolyte Pollutant
HUO Shao-xin;,XIE Qi-lin;
HUO Shao-xin;,XIE Qi-lin;
..............page:342-344,355
Research on a Case of Lower-stress Fracture of Solder and Its Enlightenment
HE Zong-peng;,WAN Cheng-an;,YANG Meng;,ZHANG Bin-bin;,ZHANG Zhen-ming;
HE Zong-peng;,WAN Cheng-an;,YANG Meng;,ZHANG Bin-bin;,ZHANG Zhen-ming;
..............page:345-348,370
Research on Influence Factors of Micro Through-hole Filling Copper Plating
CHEN Chang-sheng;,WU Pan;
CHEN Chang-sheng;,WU Pan;
..............page:349-351,376
..............page:352-355
..............page:356-358
Research on Reflow Process of SMT/THT Mix-assembly
LIANG Hui-qing;,TANG Ying;,XIAO Feng;
LIANG Hui-qing;,TANG Ying;,XIAO Feng;
..............page:359-362,370
Application of 6σto Optimize Thin Film Manufacturing Process
QIN Yue-li;,WANG Chun-fu;,XIANG Bo;
QIN Yue-li;,WANG Chun-fu;,XIANG Bo;
..............page:363-366
Application of Green Chips Tumbling in MLCC Manufacturing
LI Xiao-yu;,LIU Xin;,PENG Zi-chong;
LI Xiao-yu;,LIU Xin;,PENG Zi-chong;
..............page:367-370
Application of PEDOT Conductive Polymer in Tantalum Capacitor Production
DONG Ning-li;,JIAO Hong-zhong;,SUN Hong-jie;
DONG Ning-li;,JIAO Hong-zhong;,SUN Hong-jie;
..............page:371-373
..............page:374-376