1001-3474
2009 Issue 4
Technic Adaptability of Lead-free Solder Paste
ZHOU Yong-xin;LEI Yong-ping;LI Ke;WANG Yong
ZHOU Yong-xin;LEI Yong-ping;LI Ke;WANG Yong
..............page:187-189,195
Discussion of Mechanism of Thermo-sonic Ball Wire Bonding
YU Zhai;WANG Zhao;CHENG Jun;TIAN Huai-wen
YU Zhai;WANG Zhao;CHENG Jun;TIAN Huai-wen
..............page:190-195
Study on Process of Wave Soldering
XIAN Fei
XIAN Fei
..............page:196-199,217
..............page:248
..............page:247
Research on Manufacturing Process of Drill Position Holes in Wave Guide Flange
FENG De-gui;HUANG Chao-hui;HE Zhang-feng
FENG De-gui;HUANG Chao-hui;HE Zhang-feng
..............page:221-223
Process Improvement of Silver Electroplating for Complicated Parts of Aluminum Alloy
WANG Ai-rong;MA Chun-quan;HE Shao-wen
WANG Ai-rong;MA Chun-quan;HE Shao-wen
..............page:218-220,223
Research of Silver Termination Electrode Paste for MLCC
ZHUANG Li-bo;BAO Sheng-xiang;WANG Rong
ZHUANG Li-bo;BAO Sheng-xiang;WANG Rong
..............page:214-217
..............page:210-213
Cleaning Process for Printed Circuit Assembly
ZHANG Ling-yun
ZHANG Ling-yun
..............page:206-209
Discussion of Lead-free and Lead Technics
SHAO Zhi-he
SHAO Zhi-he
..............page:203-205,209
Solution of Reject Chips for Chip Placement
LI Xi-zhang;REN Bo-cheng
LI Xi-zhang;REN Bo-cheng
..............page:200-202
Choice of Flux in Electronic Assembly
SHI Jian-wei;XU Yuan;WANG Jian-bin;LIANG Quan
SHI Jian-wei;XU Yuan;WANG Jian-bin;LIANG Quan
..............page:242-246
..............page:239-241
Assembling of Expandable Shelter
QIAN Zuo-ao;ZHANG Ye
QIAN Zuo-ao;ZHANG Ye
..............page:236-238
Technology for Restraint Deformation of Invar Waveguide
TANG Li;GAO Yi-hui
TANG Li;GAO Yi-hui
..............page:233-235
New Technics of NdFeB Surface Treatment
ZHANG Lei;JING Cui
ZHANG Lei;JING Cui
..............page:230-232
Leak Detection Technology of Vacuum Equipment
DING Yong-sheng
DING Yong-sheng
..............page:226-229
..............page:224-225,229