1001-3474
2009 Issue 3
Study of MEMS Compound Sacrificial Layer
WANG Chao;ZHANG Yong-hua;GUO Xing-long;OU-YANG Wei-xia;LAI Zong-sheng
WANG Chao;ZHANG Yong-hua;GUO Xing-long;OU-YANG Wei-xia;LAI Zong-sheng
..............page:125-127,136
Application of Active Element to Cu/diamond Composites
DENG Li-fang;ZHU Xin-kun;TAO Jing-mei;SHANG Qing-liang;XU Meng-chun
DENG Li-fang;ZHU Xin-kun;TAO Jing-mei;SHANG Qing-liang;XU Meng-chun
..............page:128-132
Creative Strategic Conception of Digitalization for Military Electrons Industry
LIU Ping;WANG Jun-feng
LIU Ping;WANG Jun-feng
..............page:133-136
Study on Pillow Effect in Lead-Free Reflow Process
SUN Lei;LIU Zhe;FAN Rong-rong
SUN Lei;LIU Zhe;FAN Rong-rong
..............page:137-140,143
Application of Hydroxy-alkyl-amine to Lead-free Solder Paste
XU Yuan;WANG Jian-bin;XIE Hai-hua
XU Yuan;WANG Jian-bin;XIE Hai-hua
..............page:141-143
Microwave Digital Composite Substrate Hole Metallization Process
SU YAN;ZUO Dun-wen
SU YAN;ZUO Dun-wen
..............page:144-146,161
Reliability Analysis of Flush Soldering
AN Li-quan;ZHENG Jian-ming;LI Feng
AN Li-quan;ZHENG Jian-ming;LI Feng
..............page:147-150
Optimization of Components Distribution on PCB Based on APDL
LIU Wen-guang;WU Fan
LIU Wen-guang;WU Fan
..............page:151-153
..............page:154-157,161
QFN Rework Technology
ZHENG Guan-qun
ZHENG Guan-qun
..............page:158-161
EBW Techniques of Digital Assembly
ZHU Li-na;QIU Han
ZHU Li-na;QIU Han
..............page:162-165,168
Application of Fountain Plating to Solder Bump Manufacture
DUAN Jin-sheng;YA Gang
DUAN Jin-sheng;YA Gang
..............page:166-168
..............page:169-171
..............page:172-174
..............page:175-177,180
Solutions to Enhance Production Efficiency of Numerical Workshop for Electronic Equipments
WEI Guang-ming
WEI Guang-ming
..............page:178-180
Choice of Flux in Electronic Assembly
SHI Jian-wei;XU Yuan;WANG Jian-bin;LIANG Quan
SHI Jian-wei;XU Yuan;WANG Jian-bin;LIANG Quan
..............page:181-184