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Electronics Process Technology
1001-3474
2008 Issue 2
Best Fitting Ellipse Using in Computing orientation of a Chip
QIU Ye;HU Yue-ming;Qi Qi-feng
..............page:63-65,70
Study of Sn-Zn Lead-free Solder by Alloying
WU Song;KANG Hui;QU Ping
..............page:66-70
Study on Board Level Circuit Module and Its Structure Optimization
ZHU Ji-yuan;ZHOU De-jian
..............page:71-73,80
DFM of PCB in the Field of SMT
LIANG Wan-lei;CAO Bai-yang
..............page:74-76,80
Performance Research of Resin-core Flux
QIN Jun-hu
..............page:77-80
Design of Low Noise Amplifier Circuit
ZENG Yi
..............page:84-86,101
An Emergent Method of Repairing PCB With BGA Pad Off
MAO Shu-qin;ZHANG Song-yan
..............page:87-88,104
Pressure Soldering Technology and Assembly Technique
WEI Jian
..............page:89-90
Harness and Cable Design and Process Based on Digital Prototype Model
LI Jian-yong;Jü Jing-yu
..............page:91-94
Development of Ceramic Material for Ultra-thin Dielectric and Big Capacitance Ni-MLCC
SONG Yong-sheng;REN Hai-dong;FU Zhen-xiao;CAO Xiu-hua
..............page:95-97
Winding Technics and Key Technologies of Film Capacitors
REN Jian;ZHANG Ai-ling
..............page:102-104
Research on Soldering of Copper and Aluminum
WU Wei-ming;GAO Yan
..............page:105-108
Formed Wire Contact's Assemble Structures
ZHAI Hong-peng
..............page:109-111,115
Trend and Current Situation of Flux for Aluminium and Its Alloys
JIN Xia;YANG Chang-jin;LIU Bao-xiang
..............page:112-115
Solder Defects and Solutions in Lead-free Soldering Technology
SHI Jian-wei
..............page:116-119
Foreign Literature Guide
..............page:120
Enterprise Garden
..............page:121-122
News
..............page:123-124