1001-3474
2008 Issue 1
xin chun ji yu
xu bao xing
xu bao xing
..............page:前插1
..............page:61-62
..............page:59-60
..............page:57-58
..............page:53-56
Rotary Ultrasonic Machining Method for Engineering Ceramics
YUE Jun;LIU Hun-ju
YUE Jun;LIU Hun-ju
..............page:49-52
..............page:46-48
..............page:43-45
Manufacturing Technics of Thin - wall Parts
ZHANG Chong;YIN Dong-ping
ZHANG Chong;YIN Dong-ping
..............page:40-42
Design of the Automatic Machine for Separating the Chip Electronic Component From the Steel Balls
Lü Yu -shan;WANG Jun;CHEN Fei;LU Fang-na;CHEN Kun
Lü Yu -shan;WANG Jun;CHEN Fei;LU Fang-na;CHEN Kun
..............page:35-39
3D Assembly Technology of Electronics Product
YANG Guan-gyu;YANG Jian-yu;HAN Yinan
YANG Guan-gyu;YANG Jian-yu;HAN Yinan
..............page:33-34,42
Technology Analysis and Temperature Control of SMT Reflow Sodlering
DENG Bei-chuan;SHEN Liang
DENG Bei-chuan;SHEN Liang
..............page:30-32
Assembly of Flip Chip Gold Bumps With Thermo- compression Bonding Process
ZHANG Cai-yun;HUO Zhuo-qin;GAO Min;ZHANG Chen-xi
ZHANG Cai-yun;HUO Zhuo-qin;GAO Min;ZHANG Chen-xi
..............page:28-29,32
Research on the Manufacture Technology of Tantalum Electrolyte Capacitor with High Frequency & Low ESR
JIANG Chun-qiang;LU Sheng;Lü Lin-xing;WU Yong
JIANG Chun-qiang;LU Sheng;Lü Lin-xing;WU Yong
..............page:24-27
Analysis and Research of SMT Print Defects
LIU Xiao-hui;WEI Dong
LIU Xiao-hui;WEI Dong
..............page:19-23
LTCC Substrate Manufacture Technology
LANG Peng
LANG Peng
..............page:16-18,39
Study of a New No - clean Flux for Lead - free Solder
LIN Yan-yong;LI Guo-wei;XIA Zhi-dong;LEI Yong-ping;YANG Xiao-jun
LIN Yan-yong;LI Guo-wei;XIA Zhi-dong;LEI Yong-ping;YANG Xiao-jun
..............page:12-15
Research of Geometric Moments Invariants in Identifying Chip
HE Xu-hao;HU Yue-ming;QI Qi-feng
HE Xu-hao;HU Yue-ming;QI Qi-feng
..............page:8-11
Novel Decapsulation Process for Plastic Packaging Electronic Device With Copper Wire Interconnection
HANG Chun-jin;WANG Chun-qing;TIAN Yan-hong;ZHANG Cheng
HANG Chun-jin;WANG Chun-qing;TIAN Yan-hong;ZHANG Cheng
..............page:5-7,11
Influence of Al on Microstructure and Mechanical Properties of the Sn- 58Bi Lead- Free Solder
LI Qun;HUANG Ji-hua;ZHANG Hua;ZHAO Xing-ke;QI Li-hua
LI Qun;HUANG Ji-hua;ZHANG Hua;ZHAO Xing-ke;QI Li-hua
..............page:1-4