Electronics Process Technology 2006 Issue 4 Assembly technology of high density and precision PCB

Journals A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Electronics Process Technology
1001-3474
2006 Issue 4

..............page:241-245

..............page:238-240,245

Technique of Plating on Aluminium Alloy
GONG Guang-fu;HU Jiang-hua;ZHANG Ye

..............page:234-237

Study on New Anti-crack Electric Transmission Device Pouring Sealant
WANG Yu-fei;SU Gui-ming;LIU Gang;JIANG Wei-Li;ZHOU Chun-yan

..............page:231-233,237

..............page:228-230

RSSI for CMOS Limiting/Logarithmic Amplifier
YANG Chun;WANG Zhi-gong;XU Jian;WANG Rong

..............page:224-227

EMC in Distribute System
LIU Quan-zhan;LüTing

..............page:221-223

PCB Made by Circuit Shifting Technology
YANG Wei-zheng

..............page:218-220

..............page:215-217

..............page:212-214,217

Research of Copper Termination Paste for BME -MLCC
YU Long-hua;MENG Shu-yuan;AN Yan;JIN Fu-zhen

..............page:209-211

..............page:205-208,211

Finite Element Analysis for Flip Chip Solder Joint Reliability
XIAO Xiao-qing;HE Xiao-qi;EN Yun-fei;ZHOU Ji-chen

..............page:201-204

Study of Sn-8Zn Lead-free Solder Weldability
SHANG Yan-geng;LANG Bo;SUN Da-qian;WU Wen-yun;HUANG Ze-wu

..............page:197-200

..............page:191-196

..............page:187-190,196