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Electronics Process Technology
1001-3474
2004 Issue 6
Surface Acoustic Wave Motor
ZHOU Guang-hua;LIU Jing-quan;YANG Bin;HUANG Shui-hua
..............page:231-233,268
Research Status of Reflow Soldering Process in SMT
HUANG Bing-yuan;HAN Guo-ming;FAN Qiang;MAO Xin-long
..............page:234-238
Research on Lead-free Solder Alloy Sn-0.7Cu Prepared By Mechanical Alloying
LIU Xin;LEI Yong-ping;XIA Zhi-dong;SHI Yao-wu;ZHANG Shu-guang
..............page:239-242
Effect of parameters of reflow oven on the Reflow Profile
FENG Zhi-gang;YU Ding-wen;ZHU Yu-he
..............page:243-246,251
Research of PCBA Assemble in Lead Free
BAI Yun;LIU Yan-xin
..............page:247-251
Foreign Literature Guide
..............page:275-276
Technique characteristic discussion of lead-free wave soldering technology and equipment
HU Qiang;LI Zhong-suo;ZHAO Zhi-li
..............page:252-255
Choice of lead-free solder and its countermeasure
LUO Dao-jun;LIN Xiang-yun;LIU Rui-huai
..............page:256-257,265
Study of the Void PTH of the Multilayer PCB
CHI Hai-rong
..............page:258-260
Overload Acceleration Sensor With Low Temperature Drift
YAN Gui-ping
..............page:266-268
Developing Trend of Liquid Crystal Pour Machine
YIN Wan-gen
..............page:269-270
Quality control of production process of manufacture shop
Lü Shu-hong;WU yong
..............page:271-272
Microelectronic Packaging Technology and SMT Will Join Hands in the Future
Kuang Yan-xiang;ZHU Song-chun
..............page:273-274