1001-3474
2004 Issue 4
..............page:183-184
Advanced Micro-electronics Packaging Technlogy in SMT
kuang yan xiang ; zhu song chun
kuang yan xiang ; zhu song chun
..............page:178-182
Returning Its Initial State Phenomenon Of A Curving Plank Material
liu lian qun ; ma guang hui
liu lian qun ; ma guang hui
..............page:174-177
Molecular Scale Computer Simulation on Procedure of Thin Film Growth
zhang ping ze ; zhang gao hui ; cui cai e ; zuo qiang ; pan jun de
zhang ping ze ; zhang gao hui ; cui cai e ; zuo qiang ; pan jun de
..............page:171-173
Stepping Integrated Electronic Rheostat
sun jian she ; wang cheng you ; chen zhi hong
sun jian she ; wang cheng you ; chen zhi hong
..............page:167-170
A Solution to Interspace in MLCC'S Through End Termination Composition and Processing
pang zuo sheng ; yao qing min
pang zuo sheng ; yao qing min
..............page:165-166,170
Errors Analysis in Assembly of LCD Glass Scriber
zhu yue hong ; gao chuang kuan ; hao chun juan ; xiao fang sheng
zhu yue hong ; gao chuang kuan ; hao chun juan ; xiao fang sheng
..............page:162-164
Parameter Process Planning for Electronic Product
yang guang yu
yang guang yu
..............page:159-161
Effects of Y2O3 on Sn-Ag-Cu Alloy and Joints
liu xiao ying ; yu da quan ; ma hai tao ; xie hai ping ; wang lai
liu xiao ying ; yu da quan ; ma hai tao ; xie hai ping ; wang lai
..............page:156-158,161
..............page:154-155
Research and Development of Sn-Zn Lead-free Solder
li xiao yan ; chen guo hai ; ma zuo sheng
li xiao yan ; chen guo hai ; ma zuo sheng
..............page:150-153
Development of No-clean Flux for Lead-free Solder
wang su li ; lei yong ping ; xia zhi dong ; shi yao wu ; li xiao yan
wang su li ; lei yong ping ; xia zhi dong ; shi yao wu ; li xiao yan
..............page:147-149
Study on ANN-based Expert-system Applied to SMT Solder Joint Quality Control
liu shi lin ; zhou de jian ; wu zhao hua
liu shi lin ; zhou de jian ; wu zhao hua
..............page:143-146
Progress of Anisotropic Conductive Adhesive for Flip Chip Packaging
wu feng shun ; zheng zong lin ; wu zuo ping ; zuo bo yi ; chen li
wu feng shun ; zheng zong lin ; wu zuo ping ; zuo bo yi ; chen li
..............page:139-142,149