1001-3474
2002 Issue 4
..............page:183-184
Lecture on electronics assembly technology (5)
li xiao zuo
li xiao zuo
..............page:181-182
Pulsed Laser Welding Technology and its Application in Integrated Circuit Manufacturing
jiang you qing ; han xue bin ; zhao guo yi
jiang you qing ; han xue bin ; zhao guo yi
..............page:177-180
..............page:174-176,180
The Release Agent of Composites Metalized by Transfer
wu li ying ; gao jian jun ; jin wu gang
wu li ying ; gao jian jun ; jin wu gang
..............page:172-173
Automatic Control System of New Liquid Crystal Pour Machine
zhang jian jun ; feng bin
zhang jian jun ; feng bin
..............page:169-171
Study of Electroless Ni-P Process and Wastewater Treatment
sun ke ning ; tang jing chun ; you hong ; fang bin
sun ke ning ; tang jing chun ; you hong ; fang bin
..............page:167-168,171
The Second Metallizing of Ceramic to metal seal
gao long qiao
gao long qiao
..............page:164-166
Defect Analysis and Process Improvement of BGA Solder Foint
li min ; feng zhi gang
li min ; feng zhi gang
..............page:160-163
Via Design of High Speed PCB
yuan zi jian ; wu zhi min ; gao ju
yuan zi jian ; wu zhi min ; gao ju
..............page:158-159,163
Hot Air Leveling Technology
qin jian guo
qin jian guo
..............page:155-157
Effect of Ag on the Material Properties of Sn-Pb Solder Alloys
liu xiao bo ; wang guo yong
liu xiao bo ; wang guo yong
..............page:152-154
..............page:149-151,154
..............page:146-148
..............page:143-145,148
Research Status and Application of Laser Reflow on Solder Bump Forming of Area Array Packages
tian yan hong ; wang chun qing
tian yan hong ; wang chun qing
..............page:139-142