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Electronics and Packaging
1681-1070
2016 Issue 8
Research of Packaging-used Silumin Alloys in Hermetic Laser Welding
XU Xiao;,LIU Yan;,CHEN Jiemin;,CHENG Kai;
..............
page:1-4
Research of the Proficiency Testing for Destructive Test
YANG Cheng;,TAN Chen;,WANG Bochun;
..............
page:5-8
Research on Contact Critical Dimension Measurement and Process Capability Improvement
LI Xinghe;
..............
page:9-13,29
Parallel FIR Filter Based on Reconfigurable Processor
GU Zhiwei;,LI Li;,FU Chuanzhang;,FU Yuxiang;,LI Wei;
..............
page:14-18
Design of Radiation Hardened D Flip-Flop Based on DICE
SUN Jing;,CHEN Zhenjiao;,TAO Jianzhong;,ZHANG Yuhan;
..............
page:19-23
Design of a DSP-based Universal Memory Interface
XIE Tongtong;,LI Tianyang;
..............
page:24-29
Design of 14-bit 1 GS/s Current Steering D/A Converter for DDS Application
YANG Junhao;,ZHANG Ganying;,ZHANG Tao;
..............
page:30-33
Design of a Bandgap Reference with Curvature Compensation
LV Jiangping;,HU Qiaoyun;
..............
page:34-36,40
Research of Relationship Between Well Doping Concentration and Breakdown Voltage in Thin-Epitaxy CMOS Chips
HAN Zhaofang;,XIE Da;,QIAO Yanmin;
..............
page:37-40
Endurance Analysis of Ge2Sb2Te5-based Phase Change Memory
LI Ying;,ZHAN Yipeng;,WANG Lei;
..............
page:41-43,48
The Performance Test and Reliability Evaluation of 150 nm GaAs PHEMT Based on the 248 nm Stepper
GUO Xiao;,ZHANG Junyun;,LIN Gang;
..............
page:44-48