1681-1070
2016 Issue 4
Performance Study of a Novel Silver-filled Conductive Adhesive Used for Die Bonding
ZOU Jiajia;,GAO Hong;,ZHOU Jinwen;
ZOU Jiajia;,GAO Hong;,ZHOU Jinwen;
..............page:1-3,17
Failure Analysis of Solder Joint in SiP Modules
PAN Shushan;,CHEN Ying;,JI Bin;
PAN Shushan;,CHEN Ying;,JI Bin;
..............page:4-8,12
..............page:9-12
The Research of Aerospace Components Measurement Applied in Space Orbit
CHEN Jiapeng;,CAI Jieming;,HUANG Xudong;,SONG Guodong;
CHEN Jiapeng;,CAI Jieming;,HUANG Xudong;,SONG Guodong;
..............page:13-17
Research on Producing Pattern Files Based on the V93000 ATE MTL
ZHAO Hua;,WANG Zhengyu;,LI Kai;
ZHAO Hua;,WANG Zhengyu;,LI Kai;
..............page:18-20,33
A Design of MBIST Based on Scan Chain Block RAM
CONG Hongyan;,YAN Hua;,HU Kai;,ZHANG Yanfei;
CONG Hongyan;,YAN Hua;,HU Kai;,ZHANG Yanfei;
..............page:21-23,28
..............page:24-28
A kind of Circuit Design of Wireless Charging Management System
YANG Peikai;,SHI Xiong;
YANG Peikai;,SHI Xiong;
..............page:29-33
Mono-Pulse Radar Receiver Based on Gain and Phase Detect
ZHI Min;,ZHANG Hui;
ZHI Min;,ZHANG Hui;
..............page:34-39
Study of Commercial 0.18μm CMOS Total Ionizing Dose Effects
KOU Chunmei;,XIE Rubin;,HONG Genshen;,WU Jianwei;
KOU Chunmei;,XIE Rubin;,HONG Genshen;,WU Jianwei;
..............page:40-44
..............page:45-47