1681-1070
2016 Issue 2
BGA Soldering Quality Detection Techniques by X Ray Imaging
HE Zhigang;,LIANG Kun;,ZHOU Qingbo;,GONG Guohu;,WANG Xiaomin;
HE Zhigang;,LIANG Kun;,ZHOU Qingbo;,GONG Guohu;,WANG Xiaomin;
..............page:1-4,8
Application of Wire Bonding of Multi-Stack Die in the Ceramic Package
LIAO Xiaoping;,GAO Liang;
LIAO Xiaoping;,GAO Liang;
..............page:5-8
Finite Element Analysis of Failure Mode of TO Ceramic Package
SI Jianwen;,GUO Huaixin;,WANG Ziliang;
SI Jianwen;,GUO Huaixin;,WANG Ziliang;
..............page:9-13
Assembly Technology Research of Magnetic Sensor in SSIP4L Package
CHEN Guolan;,NIU Sheqiang;,HE Wenhai;
CHEN Guolan;,NIU Sheqiang;,HE Wenhai;
..............page:14-18
..............page:18
Microsystems Analysis and Design
YANG Fang;,WANG Liangjiang;
YANG Fang;,WANG Liangjiang;
..............page:19-22
yun yong xian you xin pian sheng cheng ji shu zhi zao de guang dian zi chu li qi dan sheng
li xing yue ;
li xing yue ;
..............page:22,27
Design of a Baseline Wander Canceller for Ethernet Transceiver
ZHANG Shuai;,XU Shengquan;,YU Jianwang;,LI Zhenghao;,QIU Yibo;,ZHENG Yan;
ZHANG Shuai;,XU Shengquan;,YU Jianwang;,LI Zhenghao;,QIU Yibo;,ZHENG Yan;
..............page:23-27
The Restrain of Ringing Phenomenon for Buck DC-DC Circuit
LAI Pengfei;,CHEN Feng;,CAO Fabing;,Li Liang;
LAI Pengfei;,CHEN Feng;,CAO Fabing;,Li Liang;
..............page:28-32
..............page:32
The Design of Ku-band T/R Module
YAO Ruoyan;,WEI Bin;
YAO Ruoyan;,WEI Bin;
..............page:33-36
Simulation Analysis of Laser Trimming Using L-Cut
LIU Jianjun;,WANG Yunlong;
LIU Jianjun;,WANG Yunlong;
..............page:37-39,48
A Kind of Highly Reliable Serial Communication Protocol
GUI Jianghua;,SHAO Jian;,PAN Miao;
GUI Jianghua;,SHAO Jian;,PAN Miao;
..............page:40-43,48
Research on Automatic Test System of High Voltage AC Parameters Based on Microcomputer
CHEN Yang;,XIE Lili;
CHEN Yang;,XIE Lili;
..............page:44-48