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Electronics and Packaging
1681-1070
2016 Issue 11
Studies of Quasi-hermetic Air Cavity Packaging
GAO Hui;,XIAO Hanwu;,LI Zongya;
..............
page:1-6,13
An Automatic Test Method for LNA
ZHANG Kaihong;,SU Yang;,WU Qianwen;
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page:7-9,22
Studies of MOS Turn-on Resistance Measurement Methods
HAN Xinfeng;,GU Weimin;
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page:10-13
A Design and Implementation Scheme of Multi-Site Test for ATE-based Power Chip
TANG Caibin;
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page:14-17,26
A Design of Bandgap Voltage Reference Circuit with Offset Voltage Elimination Function
XU Shengquan;,ZHANG Shuai;
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page:18-22
Studies of FPGA Switch Matrix
HU Kai;,XIE Da;,LIU Tong;,ZHANG Yanfei;,SHAN Yueer;
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page:23-26
A Design of RF Front-end TR Module for Altimeter Measuring System
CAI Mao;,PAN Bei;,YU Jian;,MA Jianjun;,WEN Yanbing;
..............
page:27-30
A Design of Electrostatic/Surge Voltage Discharge Structure for Control Port of Microwave Control Circuit
PAN Jiebin;,CHEN Jixue;,JIANG Nan;
..............
page:31-34
Studies of Resonance Process for Shifted-Phase Full-Bridge Zero-Voltage PWM Soft-Switching Circuit
WANG Jingang;,LIU Peng;
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page:35-38,43
Design and Application of Wideband Directional Coupler
WANG Jiabo;,CAO Xuesong;
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page:39-43
An Optimization Method of 1200 V IGBT
LI Hong;
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page:44-47