1681-1070
2016 Issue 1
Analysis of Hook Position in Double Bond Pulling Test
LING Yong;,LV Yin;
LING Yong;,LV Yin;
..............page:1-4
Delamination and Its Countermeasures in IC Plastic Package
ZHOU Chaofeng;,ZHOU Jincheng;,LI Xizhou;
ZHOU Chaofeng;,ZHOU Jincheng;,LI Xizhou;
..............page:5-8,37
..............page:9-11
wu li xue jia fa xian xin chu neng cai liao
li xing yue ;
li xing yue ;
..............page:11-11
..............page:12-15
The Functional Verification and Simulation of McBSP Communication Based on SPI Protocol
SUN Jing;,TAO Jianzhong;,CHEN Zhenjiao;
SUN Jing;,TAO Jianzhong;,CHEN Zhenjiao;
..............page:16-20
Synchronous Rectification DC/DC BOOST Soft Start Circuit
LI Liang;,LAI Pengfei;,CAO Fabing;,CHEN Feng;
LI Liang;,LAI Pengfei;,CAO Fabing;,CHEN Feng;
..............page:21-24,30
Research of Synchronization for Signals Cross Clock Domains in SoC Design
WANG Jian;,ZHANG Lei;,WANG Zhen;,ZHAO Zhonghui;,CHEN Yaning;
WANG Jian;,ZHANG Lei;,WANG Zhen;,ZHAO Zhonghui;,CHEN Yaning;
..............page:25-30
A Design of Circuit of RDC on the Basic of the TypeⅡ Tracking Loop Algorithm
LIU Taiguang;,BAO Shenghui;,MIAO Yun;,QIANG Xiaoyan;
LIU Taiguang;,BAO Shenghui;,MIAO Yun;,QIANG Xiaoyan;
..............page:31-33,37
A Buried-layer Epitaxy Technology by Varying Temperature and Doping Flow
ZHAO Jianjun;,XIAO Jiannong;,MA Linbao;
ZHAO Jianjun;,XIAO Jiannong;,MA Linbao;
..............page:34-37
Repair and Application of IC Handler
ZHOU Chun;,JIANG Wenguang;
ZHOU Chun;,JIANG Wenguang;
..............page:38-43,48
Software Design of Embedded Image-processing System Based on TMS320DM8168
WANG Xiaolong;,SHAO Chunwei;,ZHU Chen;
WANG Xiaolong;,SHAO Chunwei;,ZHU Chen;
..............page:44-48