1681-1070
2014 Issue 7
3D-TSV Package Technology
JI Yong;,MING Xuefei;,YAN Yingqiang;
JI Yong;,MING Xuefei;,YAN Yingqiang;
..............page:1-5
The Simulation Study of Quartz Crystal Resonator with Consideration of the Ceramic Package Structures
LI Jianzhong;,LI Jiliang;,WANG Ji;,WU Rongxing;,YU Lanzhen;
LI Jianzhong;,LI Jiliang;,WANG Ji;,WU Rongxing;,YU Lanzhen;
..............page:6-8
The Inlfuence of Relfow Proifle on Voids of CBGA Solder Joints
HUANG Yingzhuo;,JIANG Xueming;,LIAN Binhao;,LIN Pengrong;,YAO Quanbin;,ZHU Guoliang;
HUANG Yingzhuo;,JIANG Xueming;,LIAN Binhao;,LIN Pengrong;,YAO Quanbin;,ZHU Guoliang;
..............page:9-11,22
Internal Vapor Control Technology of Glass Sealing
CHEN Tao;,GUO Wei;
CHEN Tao;,GUO Wei;
..............page:12-13,39
Modiifcation of SnAgCuGa Filler Metals for Electronic Packaging
HE Qin;,REN Rugui;,ZHAO Xiaoping;
HE Qin;,REN Rugui;,ZHAO Xiaoping;
..............page:14-15,48
..............page:16-18,28
The Analyse and Comparison of Three Compensation Structures Used for Two-stage Cascode Operational Ampliifer
HU Lizhi;,QIAO Ming;
HU Lizhi;,QIAO Ming;
..............page:19-22
Design and Application of CMOS Low Voltage Devices in High Pressure Process
HUA Mengqi;,XUAN Zhibin;,ZHANG Youdan;,ZHU Qi;
HUA Mengqi;,XUAN Zhibin;,ZHANG Youdan;,ZHU Qi;
..............page:23-25
Research on Poly Process Issue During Trench VDMOS Manufacture Process
MA Wanli;,ZHAO Wenkui;
MA Wanli;,ZHAO Wenkui;
..............page:26-28
An Optimization of Triple Diffusion Process for MCT with High di/dt
CHEN Wanjun;,PENG Zhaofei;,RUAN Jianxin;,SUN Ruize;,ZHANG Bo;
CHEN Wanjun;,PENG Zhaofei;,RUAN Jianxin;,SUN Ruize;,ZHANG Bo;
..............page:29-33
Research of Realizing Balanced Emission Spectra of Dual-blue Wavelength Light-emitting Diodes
YAN Qirong;,ZHANG Yong;
YAN Qirong;,ZHANG Yong;
..............page:34-39
Study of Radiation-hard SOI Gate Oxide Reliability
GU Xiang;,LIU Guozhu;,WU Jianwei;,XIE Rubin;
GU Xiang;,LIU Guozhu;,WU Jianwei;,XIE Rubin;
..............page:40-43
..............page:44-48