1681-1070
2011 Issue 3
A Level Conversion Chip in CMOS Process
ZHOU Zi-ang;WU Ding-yun;XU Kun;ZHANG Li-hong
ZHOU Zi-ang;WU Ding-yun;XU Kun;ZHANG Li-hong
..............page:22-24
Failures in N-way Power Combining
CAI Yu;CHENG Hai-feng
CAI Yu;CHENG Hai-feng
..............page:33-35
..............page:41-43
A Design of a High Frequency Bipolar Oscillator Circui
YI Feng;HE Ying;GUO Hai-ping
YI Feng;HE Ying;GUO Hai-ping
..............page:18-21,40
..............page:13-17
..............page:44-48
Research on the Optic Fiber C2H2 Sensor Using LED as the Light Source
ZHANG Cao;LUO Rong-hui;LIU Xiao-ling;GUO Xiao-wei;CHU Guang-yong
ZHANG Cao;LUO Rong-hui;LIU Xiao-ling;GUO Xiao-wei;CHU Guang-yong
..............page:36-40
Fail Analysis of CRACK
WANG Dian-nian;LI Jin;GUO Ben-dong
WANG Dian-nian;LI Jin;GUO Ben-dong
..............page:10-12,17
BEOL cu Interconnect SiN Deposition VBD study
GUI Peng;WANG Hui
GUI Peng;WANG Hui
..............page:25-28,35
Three Dimensional Finite Element Analysis of Heat Dissipation of the Embedded Power Chips in the LTCC
CHEN Pin;WU Zhao-hua;HUANG Hong-yan;ZHANG Sheng;ZHAO Qiang
CHEN Pin;WU Zhao-hua;HUANG Hong-yan;ZHANG Sheng;ZHAO Qiang
..............page:5-9
Several Factors of Affecting Adhesive Force for Thick Film Conductors
YANG Yi-jie;WU Run-lin
YANG Yi-jie;WU Run-lin
..............page:1-4,9
The Study of Preparation and Relibility of the Ultra-thin Oxide
LIU Guo-zhu;CHEN Jie;LIN Li;XU Shuai;WANG Xin-sheng;WU Xiao-dong
LIU Guo-zhu;CHEN Jie;LIN Li;XU Shuai;WANG Xin-sheng;WU Xiao-dong
..............page:29-32