Electronics and Packaging 2011 Issue 2 Modeling and Simulation for Surface Indirect Lifetime in Drift Region of TF SOI NLIGBT at Light Injection and Accumulative Conditions

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Electronics and Packaging
1681-1070
2011 Issue 2

Modeling and Simulation for Surface Indirect Lifetime in Drift Region of TF SOI NLIGBT at Light Injection and Accumulative Conditions
ZHANG Hai-peng;LI Hao;LIU Guo-hua;NIU Xiao-yan

..............page:26-29

Analysis of ESD Performance for Gate Grounded NMOS Device
LI Liang;ZHU Ke-han

..............page:18-21

xin xi dong tai

..............page:3,8,29,38,43-48

The Study of Solder Paste Printing Parameter Optimizing Control based on Lead-free Sourface Mount Technology
XU Jian-li

..............page:1-3

The Semiconductor Packaging Technology of AuSn Solder with Low-temperature based on Vacuum
LI Bing-wang;XU Chun-ye

..............page:4-8

Research of Crystal Oscillator for Space Thermal Vacuum Performance
YANG Hui;BAI Hua;LIU Yan-fang

..............page:22-25

Improve the First Pass Yield of Process and Reduce Quality Cost
LI Shuang-long

..............page:39-42

The Research Progress of Microphone based Photoacoustic Spectroscopy Gas Detection
LIU Xiao-ling;LUO Rong-hui;ZHANG Cao;GUO Xiao-wei

..............page:34-38

Design of a High Performance Current and Voltage Protection Circuit by Bipolar
YI Feng;WU Xu;GUO Hai-ping

..............page:15-17

A Study of Wide Frequency Ku-band High-power Solid-state Amplifier
CAI Yu;FENG He;CAO Hai-yong

..............page:30-33

△VBE Test Apply in the Product Line
CHEN Ju-hua

..............page:9-11,25

Research and Design of a High Speed Mask ROM
Xu Rui;MAO Guo-jun

..............page:12-14,47