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Electronics and Packaging
1681-1070
2010 Issue 7
The Development of a 200V/100A VDMOS Device
jiao shi long ; weng chang yu ; jin hu
..............page:20-23
Brief Analysis Shunt Capacitor\'s Characteristic and Application in PCB
cai zuo ; zou xue feng ; luo ; sang nai xia ; huang ming zuo
..............page:35-39
The Design of Wireless Temperature and Humidity Sensor Node Based on MSP430F2012 and CC1100
guo li xia ; li zheng bin ; yang xin
..............page:12-15
Research of Dynamic Burn-in Test for FPGA IC
yu zhen hua ; zhu wei liang
..............page:24-27
The Relationship between INL and THD in ADC Testing
xu zi ming ; wu jun ; huang yun
..............page:7-11,47
MOSFET Devices Wire Bonding Technology
chen hong shi
..............page:1-3
Design of A New Over-current Protection
wang xiao long ; chen chang ; gong min
..............page:16-19
An Anti-electromagnetic Radition Package Technology for Electronic Fuse
cao chang de ; cai wen jing ; shao li huan ; qin hui bin
..............page:4-6
xin xi dong tai
..............page:6,15,27,30,40-47,48