Home | Survey | Payment| Talks & Presentations | Job Opportunities
Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronics and Packaging
1681-1070
2010 Issue 12
The Research of Radiation Mechanism on SONOS of EEPROM Cell
LV Chun;JIANG Ting;ZHOU Xin-jie
..............page:32-35
The Design of Digital Attenuator Sealed in Metal-ceramic Surface-mount Tube
SHEN Hong-chang;SHEN Ya
..............page:1-4,19
Research on Reliability of QFP Solder Joint
DENG Xiao-jun
..............page:8-11
DC-DC Converter based on the TL494
ZHANG Bo
..............page:23-26
Comparator Applicable for High Speed High Resolution ADC
PAN Xiao-min;FAN Xiao-jie;CHEN Yu-jiao
..............page:20-22,31
Methods in Decreasing GaAs LED Wire-bonding Pitfalls
HOU Yu-zeng;ZHANG Jing
..............page:12-15
The Research of GS Leakage for a VDMOS Device
LU Ning
..............page:27-31
The Study for Bipolar Layout Structure
ZHENG Ruo-cheng;CHEN Jiang
..............page:36-40
xin xi dong tai
..............page:43-48
Failure Analysis and Wire Bonding Improvement of PIN Diode with a Convex Plate
XIAO Shi-man;LI Shao-ping
..............page:5-7,11