Home | Survey | Payment| Talks & Presentations | Job Opportunities
Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronics and Packaging
1681-1070
2009 Issue 2
How to Decrease Badness of PIP Process
MU Shu-xian;SHI Qi-jun
..............page:35-40
Total Dose Radiation Characteristics of SOI MOSFET
HONG Gen-shen;XIAO Zhi-qiang;GAO Xiang-dong;HE Yu-juan;XU Jing;CHEN Zheng-cai
..............page:32-34
Design and Implement of CapSense Based on AD7142
ZHENG Sheng-tu;LUO Sheng-qin
..............page:24-26
4 Gbps Low Power Serializer CMOS IC
BIAN Zhen-peng;YAO Ruo-he;ZHENG Xue-ren
..............page:21-23,40
Test System of a Digital-controlled Four Channel Audio Processor Based on VI Technology
LU Jun;WANG Qing-yan;CAO Jun;LU Feng
..............page:16-20
SIP Packaging Technology
WANG A-ming;WANG Feng
..............page:11-15
The Status and Future Prospects of System-in-Package Technology
LI Zhen-ya;ZHAO Yu
..............page:5-10