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Electronics and Packaging
1681-1070
2009 Issue 2
The Exploration of Optimizing the Interface of Information System in Cooperative Medical Institutions
ZHANG Hong-tao;WU Xi-sheng
..............
page:41-43
How to Decrease Badness of PIP Process
MU Shu-xian;SHI Qi-jun
..............
page:35-40
Total Dose Radiation Characteristics of SOI MOSFET
HONG Gen-shen;XIAO Zhi-qiang;GAO Xiang-dong;HE Yu-juan;XU Jing;CHEN Zheng-cai
..............
page:32-34
The Design of Continuous Adjustment in a Large Scale for Thick-Film Resistors
XIA Jun-sheng
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page:27-31
Design and Implement of CapSense Based on AD7142
ZHENG Sheng-tu;LUO Sheng-qin
..............
page:24-26
4 Gbps Low Power Serializer CMOS IC
BIAN Zhen-peng;YAO Ruo-he;ZHENG Xue-ren
..............
page:21-23,40
Test System of a Digital-controlled Four Channel Audio Processor Based on VI Technology
LU Jun;WANG Qing-yan;CAO Jun;LU Feng
..............
page:16-20
SIP Packaging Technology
WANG A-ming;WANG Feng
..............
page:11-15
The Status and Future Prospects of System-in-Package Technology
LI Zhen-ya;ZHAO Yu
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page:5-10
The Challenge Faced by the IC Packaging and Testing Industry under the International Financial Crisis
YU Xie-kang
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page:1-4