Electronics and Packaging 2009 Issue 11 FOW Die Attach Method Application in Stack CSP Package Assembly

Journals A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Electronics and Packaging
1681-1070
2009 Issue 11

..............page:1-4,11

..............page:24-26,46

Comparing Automatic Test Pattern Generation System
lu xiao zuo ; luo sheng qin

..............page:21-23

Testing and Improvement of Insulator
chen zuo zuo ; wang zi liang ; hu jin

..............page:17-20

..............page:12-16,20

Packaging Structure and Technology of Power Electronic Module
yu xiao dong ; he hong ; song xiu feng ; zeng jun ; li ran ; shi zhi xiang

..............page:5-11

..............page:34-36

System Design of Digitally Controlled DC-DC Converter
xiong fu rong ; wu jin ; zhao xia ; zheng li xia

..............page:29-33

The Real-time Video Image Communication Base on the DM642
cui li zhen ; zhang xiang song

..............page:27-28,46

The Design of High-voltage Intelligent Compound Switch
zhou jing ; ye wei hua ; li fu peng ; liu dun

..............page:41-46

..............page:37-40

xin xi bao dao

..............page:47-48