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Electronics and Packaging
1681-1070
2008 Issue 12
Research and Development of Positive-working Photosensitive Polyimides(1)
LIU Jin-gang;YUAN Xiang-wen;YIN Zhi-hua;ZUO Li-hui;YANG Shi-yong
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page:1-6
The Investigation of the Process of Growing Epitaxial Layer on Heavy Arsenic Doping Substrate
GAO Xiang;CHENG Xiu-lan;LI Zhi-peng
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page:7-9
Junction Temperature Measurement of High-power White LED
TIAN Da-lei;GUAN Rong-feng;WANG Xing;ZHAO Wen-qing
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page:10-12,16
The New Method for IC ESD Protect Constructures-TLP
LU Ban;ZHU Wei-liang
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page:13-16
Study of Failure in ESD Protection Circuit in E2PROMIC
YI Feng;WAN Ying
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page:17-19
A High-Speed Fully Differential CMOS Op-Amp
LIN Wu-ping;GUO Liang-quan;LI Liang;HUANG Zhao-jun
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page:20-23,26
Testing Method of Driver & Controller for Dot Matrix LCD
ZHANG Shao-yun;WANG Zheng-yu
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page:24-26
Research on Grounding Design
HUA Cheng;ZHANG Jian;HUANG Bin;CAI Hong;DU Ying
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page:27-30
Quanta Electronic Devices and Their Applications
LUO Hao-ping;WANG Hong-lin
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page:31-35
Network EPG Technology Applicanced in HD Recorder
XU Ning
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page:36-39
The Analyse About the Future and Countermeasure of IC Industry
XIAO Li;ZHAO Ying
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page:40-44