1681-1070
2007 Issue 8
..............page:后插1
..............page:43-48
The Method Research for Repressing to Conducted Coupling
DU Ying;HUA Cheng
DU Ying;HUA Cheng
..............page:39-42
LIMS Implementation Report
ZHU Wei-liang;LU Jian
ZHU Wei-liang;LU Jian
..............page:34-38
Analyzing and Designing of SCR-Structured ESD Protection with ISE-TCAD
XIANG Li-yan;WU Qi-rong;GONG Min;CHEN Chang
XIANG Li-yan;WU Qi-rong;GONG Min;CHEN Chang
..............page:30-33,38
The Optimized Design of Routing Switch and Wire Segment of FPGA
WANG Chun-zao;ZHANG Han-fu;SHI Liang
WANG Chun-zao;ZHANG Han-fu;SHI Liang
..............page:27-29
A Dual Channel Bus Transceiver's Design
LUO Sheng;ZOU Wen-ying;GU Zhan-hong
LUO Sheng;ZOU Wen-ying;GU Zhan-hong
..............page:24-26
The Layout Design of Muti-power Network
WANG Yue-ling
WANG Yue-ling
..............page:21-23
How to Avoid EOS Damage During the MOSFET Test
CHEN Ju-hua
CHEN Ju-hua
..............page:17-20
Influences of Package Structure and Material Thermal Conductivities on Thermal Performance of FC-BGA
HUANG Wei-dong;LUO Le
HUANG Wei-dong;LUO Le
..............page:11-16
Eutectic Solder Technology of Hybrid Circuit Substrate and Package
HOU Yi-xue;QIAO Hai-ling;LIAO Zhi-li
HOU Yi-xue;QIAO Hai-ling;LIAO Zhi-li
..............page:9-10,20
Application Feature and Development of Lead-Free Solders Used in Electronical Product
SU Jia-jia;WEN Jian-guo
SU Jia-jia;WEN Jian-guo
..............page:5-8
Investigation on Gold Ball Bonding Technologies for High-density Ceramic Package
YANG Bing;GUO Da-qi
YANG Bing;GUO Da-qi
..............page:1-4,16