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Electronics and Packaging
1681-1070
2007 Issue 1
Green Design of Switch Mode Power Supplies IC
ZHU Wei-min
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page:1-3
The Preparation and Properties of Epoxy Molding Compounds Filled with Multiple Ceramic Particles
HAN Yan-chun;FU Ren-li;HE Hong;SHEN Yuan;SONG Xiu-feng
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page:4-7,13
The Analysis of PEMs Reliability
WAN Yan-shu
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page:8-13
Effect of the Plasma Cleaning Process on Plastic Ball Grid Array Package Assembly Reliability
YANG Jian-sheng
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page:14-18,35
The Research of Wave Soldering
XIAN Fei
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page:19-22
Design and Optimization of the High Voltage PLDMOS
XIAO Jin-yu
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page:23-28
The Risks and the Solutions in the Conversion from FPGA to ASIC
Wang Guo-zhang;Gao Xiao-liang;Yu Zong-guang;Xu Zi-ming;Liu Zhan
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page:29-31
A 5GHz Power Amplifier Implement in 0.18 μm CMOS Technology
CHEN Chao;LI Zhi-qun;WANG Zhi-gong;LI Wei
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page:32-35
Development of an Advance Small Size Metal-Gate CMOS Process
SU Wei;TU Ji-yun
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page:36-38,48
Operation and Maintenance of Toshiba's Model 130 Frequency Converter
WANG Li-peng;HU Xiao-lin
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page:39-42
System's Frame of Induction Motor Vector Control System Based on ARM MCU
LI Jing;XIANG Feng-hong;ZHANG Yong;FAN Yang-liu
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page:43-45,48
siconnect di yi kuan dian li xian shou fa qi ti gao jia yong dian li xian wang luo xing neng
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page:22
zhong guo dian zi ke ji ji tuan gong si di wu shi ba yan jiu suo er liu nian du xin pin she ji ding xing zuo cheng guo jian ding hui zai xi zhao kai
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page:46
chan xue yan qi ju gong hua feng zhuang shui qi han liang jie jue fang an
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page:46-47
dian zi yu feng zhuang chuang kan wu zhou nian zhi ci
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page:前插1
dian zi yu feng zhuang za zhi zheng gao qi shi
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page:后插1