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Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronics and Packaging
1681-1070
2007 Issue 1
Green Design of Switch Mode Power Supplies IC
ZHU Wei-min
..............page:1-3
The Preparation and Properties of Epoxy Molding Compounds Filled with Multiple Ceramic Particles
HAN Yan-chun;FU Ren-li;HE Hong;SHEN Yuan;SONG Xiu-feng
..............page:4-7,13
The Analysis of PEMs Reliability
WAN Yan-shu
..............page:8-13
The Research of Wave Soldering
XIAN Fei
..............page:19-22
Design and Optimization of the High Voltage PLDMOS
XIAO Jin-yu
..............page:23-28
The Risks and the Solutions in the Conversion from FPGA to ASIC
Wang Guo-zhang;Gao Xiao-liang;Yu Zong-guang;Xu Zi-ming;Liu Zhan
..............page:29-31
A 5GHz Power Amplifier Implement in 0.18 μm CMOS Technology
CHEN Chao;LI Zhi-qun;WANG Zhi-gong;LI Wei
..............page:32-35
Development of an Advance Small Size Metal-Gate CMOS Process
SU Wei;TU Ji-yun
..............page:36-38,48
Operation and Maintenance of Toshiba's Model 130 Frequency Converter
WANG Li-peng;HU Xiao-lin
..............page:39-42
System's Frame of Induction Motor Vector Control System Based on ARM MCU
LI Jing;XIANG Feng-hong;ZHANG Yong;FAN Yang-liu
..............page:43-45,48