1681-1070
2006 Issue 9
The Research Study of Ceramic Quad Flat Pack
XU Yi-fan;YU Yong-mei
XU Yi-fan;YU Yong-mei
..............page:22-25
The Development and Heat Dispersion Problem in Integrate Circuit Packaging
ZENG Li;CHEN Wen-yuan;XIE Shi-wen;YANG Bang-chao
ZENG Li;CHEN Wen-yuan;XIE Shi-wen;YANG Bang-chao
..............page:15-21
Design of Silicon Substrate for MCM Packaging
DING Jun-min;WU Xiao-chun;SUN Ling
DING Jun-min;WU Xiao-chun;SUN Ling
..............page:11-14
The High-Speed, Low-Cost, Lead-Free Challenge for Flip-Chips
YANG Jian-sheng
YANG Jian-sheng
..............page:7-10
MCM-C Hermetically Metal Sealing Techniques
HE Zhong-wei;LI Shou-sheng
HE Zhong-wei;LI Shou-sheng
..............page:1-6
..............page:26-28,44
Digital Signal Process Design Principle
CHEN Xin;JIANG Ting
CHEN Xin;JIANG Ting
..............page:29-31
Holey Fiber Laser Have the Potential to Revolutionize Fiber Lasers
LUO Yan-heng;ZHANG Rui-jun
LUO Yan-heng;ZHANG Rui-jun
..............page:32-37
Research of the Normal Grain Growth in Thin Films
HAN Jun;ZHAO Xiu-chao
HAN Jun;ZHAO Xiu-chao
..............page:38-40
Contamination and Block up of Plate Heat Exchanger and Effect of Cleaning on Energy Consumption
QIN Xin-an;WANG Tie-kun
QIN Xin-an;WANG Tie-kun
..............page:41-44