The Tendency of SoC and FPGA in the Future
Yu Zong-guang;Wei Jing-he;Wang Guo-zhang

..............page:1-5

Packaging and Performance of 980nm Broad Area Semiconductor Lasers
Xingsheng Liu;Lawrence C. Hughes;Michael H. Rasmussen;Martin H. Hu;Venkata A Bhagavatula;Ronald W. Davis;Sean Coleman;Rajaram Bhat;Chung-En Zah

..............page:6-14

Applications of Parallel Seam Welding
Liu Yan;Cao Kun;Chen Kai;Tu Chuan-zheng

..............page:15-16,20

Research on the Process of Ceramic Leadless Chip Carrier Package
Yu Yong-mei

..............page:17-20

The Total Solution: EDA Linkage
Wei Wei

..............page:21-23

A Bandgap Reference with the Exponential Curvature Temperature Compensation
Liang Jing;Wang Ji-an;Zhang Xiao-kun;Xu Shang-lin;Li Wei;Gong Min

..............page:24-28

The Design of ISP/IAP System in Microcontroller
Xiao Ying-ying;Yin Rui-xiang;Zheng Yu-hua;Wang Yu-xin

..............page:29-32,5

The Design of FPGA Based on VHDL
Chen Yi-jun

..............page:33-36,43

The Development of Salicide in Sub-micron Process
Liu Yun;Chen Hai-feng

..............page:37-39

The Application of Laboratory Information Management System
Zhu Wei-liang;Duanmu Zhu-jun

..............page:40-43

xin xi bao dao

..............page:28,43,44-48