1681-1070
2006 Issue 2
..............page:1-4
Flat Bump Package
Liang Zhi-zhong;Tao Yu-juan
Liang Zhi-zhong;Tao Yu-juan
..............page:5-9
Comprehensive Warpage Analysis of Stacked Die MEMS Package in Accelerometer Application
Xue-ren Zhang;Tong Yan Tee;Jing-en Luan
Xue-ren Zhang;Tong Yan Tee;Jing-en Luan
..............page:10-15,4
Study on Properties of High Reinforcement-content Aluminum Matrix Composite for Electronic Packages
Xiu Zi-yang;Zhang Qiang;Wu Gao-hui;Song Mei-hui;Zhu De-zhi
Xiu Zi-yang;Zhang Qiang;Wu Gao-hui;Song Mei-hui;Zhu De-zhi
..............page:16-19
Relationship Between Resin and PKG Delamination
Xie Guang-chao
Xie Guang-chao
..............page:20-23
..............page:24-27
Design of an In-vehicle CAN Bridge Based on MCU
Ding Sheng-yan;Luo Feng;Sun Ze-chang
Ding Sheng-yan;Luo Feng;Sun Ze-chang
..............page:28-32
Design of a Kind of Dual Switching Capacitor Charge Pump with Boosting Voltage Structure
Zhang Jia;Wang Ji-an;Wang Na;Shang Xiao-dan;Zhang Zhao;Li Wei;Gong Min
Zhang Jia;Wang Ji-an;Wang Na;Shang Xiao-dan;Zhang Zhao;Li Wei;Gong Min
..............page:33-36,19
CPLD Design Based on S5933 of the High-speed Data Transmitter Card
Zhu Qiang;Zhao Yi-gong
Zhu Qiang;Zhao Yi-gong
..............page:37-40
Design Magnetic Suspension System Based on DSP and Electrical&Electron
Wang Liang;Wang Li-de;Wang Yong-xiang
Wang Liang;Wang Li-de;Wang Yong-xiang
..............page:41-44
..............page:9,32,44-48