Electronics and Packaging 2006 Issue 10 Discussion about Sn-Zn Lead-free Solder from Patent Angle

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Electronics and Packaging
1681-1070
2006 Issue 10

Discussion about Sn-Zn Lead-free Solder from Patent Angle
LU Na;ZENG-Ming

..............page:1-4

Research on Stability of Conductive Adhesion Contact Resistance
ZHANG Xiao-bo;JIANG Yan-feng

..............page:5-9

Development and Application of Network Storage in Enterprise
HU Tian-xiang

..............page:39-42

Chip Defect Analysis Based on COB Assembly Process
ZHANG Ji;LIU Ming-feng;GUO Liang-quan;WANG Cheng

..............page:35-38

Review of HAST and Limit Test
YANG Chun-hong;LI Bin;LAI Ping;WANG Mao-ju;EN Yun-fei

..............page:31-34,38

An Integrated Micro-optical System for VCSEL-to-fiber Active Alignment
LUO Yan-heng;ZHANG Rui-jun

..............page:27-30

Invalidation Analysis and Reliability Design of Multilayer Ceramic Package
TANG Ji-nan

..............page:22-26

Shear Fracture Model of Lead-free Solder Bump Formed with Induction Self Heat Reflow
LI Ming-yu;XU Hong-bo;Jong-Myung Kim;Hong-Bae Kim

..............page:17-21,38

The Full Ceramic Packaging of the LiNbO3 SMD
WANG Bao-wei

..............page:14-16,26

Raising the Efficience and Quality of Electronics Manufacture with Gerber Files
XIAN Fei

..............page:10-13